Shear-Mode Grinding Based on The Constant Grinding Force.

Imai, Kenichiro; Hashimoto, Hiroshi

doi:10.2493/jjspe.63.849

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2010

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“…In the previous study, a #3000 grinding wheel was used to grind BK7 glass. Under optimal grinding conditions, a constant grinding force is exerted on a workpiece during ductile-mode grinding [1]. The existence of such a constant force results in a ground surface without cracks, no residual stock removal, and a consistent number of successive grits [2].…”

Section: Introductionmentioning

confidence: 99%

Thrust Force Directional Vibration-Assisted Ductile-Mode Grinding of Single-Crystal Si

Imai

Hashimoto

2010

AMR

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Under optimum grinding conditions, a constant grinding force is exerted on a workpiece during ductile-mode grinding of BK7 glass. Based on the results, the cutting force, specific grinding energy, and depth of cut for a single grain were calculated. It was found that a single grain was easily removed from the material. However, grinding is impossible because surface burning occurs on the workpiece. In order to avoid burning, a single-crystal silicon wafer (1,0,0) surface was ground with thrust force directional vibration-assisted grinding. The normal grinding force with vibration was comparatively low, but was quite stable. The removal rate was approximately three times greater than that without vibration. The results indicate that the successive abrasive grains of the grinding wheel remove the material intermittently.

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Section: Introductionmentioning

confidence: 99%