Shock wave analysis of laser assisted particle removal

Lee, S. J.; Imen, K.; Allen, Susan D.

doi:10.1063/1.355017

Cited by 43 publications

(13 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…A shock wave created by the laser-induced explosive evaporation of a thin liquid layer was observed in Ref. 10, however the influence of the shock wave on the size of the cleaned area was not studied.…”

Section: A Traditional and Laser Techniques For Surface Cleaning Andmentioning

confidence: 97%

“…Some of them 4,5,[7][8][9][10][11][12] are wet techniques and are based on the deposition of a thin liquid film on the surface, with the subsequent explosive evaporation of the adsorbed film by laser heating. Such rapid evaporation produces forces, which are larger than the adhesion force, and propel the particles off the substrate.…”

Section: A Traditional and Laser Techniques For Surface Cleaning Andmentioning

confidence: 99%

“…In recent years several laser cleaning techniques [4][5][6][7][8][9][10][11][12] have been developed. Some of them 4,5,[7][8][9][10][11][12] are wet techniques and are based on the deposition of a thin liquid film on the surface, with the subsequent explosive evaporation of the adsorbed film by laser heating.…”

Section: A Traditional and Laser Techniques For Surface Cleaning Andmentioning

confidence: 99%

See 2 more Smart Citations

Interaction of laser-generated surface acoustic pulses with fine particles: Surface cleaning and adhesion studies

Kolomenskii

Schuessler

Mikhalevich

et al. 1998

Journal of Applied Physics

View full text Add to dashboard Cite

Exploitation of thermophoresis effect to prevent re-deposition of expelled particulates in laser assisted surface cleaning J. Appl. Phys. 112, 084903 (2012) Tip preparation for near-field ablation at mid-infrared wavelengths Rev. Sci. Instrum. 83, 103703 (2012) Tellurium-modified silicon nanowires with a large negative temperature coefficient of resistance Appl. Phys. Lett. 101, 133111 (2012) Tapered and aperiodic silicon nanostructures with very low reflectance for solar hydrogen evolution Appl. Phys. Lett. 101, 133906 (2012) Minimizing scattering from antireflective surfaces replicated from low-aspect-ratio black siliconThe mechanical forces associated with the surface acceleration in high-amplitude surface acoustic waves ͑SAWs͒ detach the particles from the surface. The removal of micron sized particles with a nanosecond SAW pulse excited by a focused laser beam in a silicon wafer was quantitatively investigated. Both vertical and horizontal particle displacements have been observed. It is shown that for nanosecond SAW pulses the limit of the surface acceleration of about 10 10 m/s 2 is set by the fracture of the material and corresponds to the removal of particles larger than about 0.05 m. In addition, the nonlinear transformation of the excited SAW pulses results in an increase of the surface acceleration and contributes to the cleaning process extending it to even smaller particle dimensions. The technique is applicable in vacuum and improves the energetic effectiveness of the cleaning due to the removal of particles not only in the irradiated region, but also in the wider area covered by the SAW pulse propagation. It can be also used for the determination of the Hamaker constant of the adhesion force.

show abstract

Section: A Traditional and Laser Techniques For Surface Cleaning Andmentioning

confidence: 97%

Section: A Traditional and Laser Techniques For Surface Cleaning Andmentioning

confidence: 99%

Section: A Traditional and Laser Techniques For Surface Cleaning Andmentioning

confidence: 99%

See 1 more Smart Citation

Interaction of laser-generated surface acoustic pulses with fine particles: Surface cleaning and adhesion studies

Kolomenskii

Schuessler

Mikhalevich

et al. 1998

Journal of Applied Physics

View full text Add to dashboard Cite

show abstract

“…Thus far, many particle removal methods are advanced out including supersonic cleaning, brush scrub, CMP, supercritical carbon dioxide, laser cleaning. [3][4][5][6][7] Dry cleaning patterns are more hopeful compared with wet cleaning due to its limits such as re-contaminates from chemicals and solvents, rinsing/drying difficulties and incompatibility with other cleaning processes. Laser dry cleaning has been compressively studied and demonstrated as an effective method for particle removal [8][9][10] .…”

Section: Introductionmentioning

confidence: 99%

Dynamics of particles removal in laser shock cleaning

Zhang

Bian

2006

SPIE Proceedings

View full text Add to dashboard Cite

Laser shock cleaning (LSC) has been proved an effective method to clean sub-micron and micron particles from solid surface during last five years. In this report, dynamics of the interaction between plasma shock wave and adhered spherical particles is analyzed in theory, considering the change of particle contact radius induced by the load of the shock wave. Analysis of the rolling mechanism at the initial contact of the shock wave with particles shows working gap has a serious influence to the cleaning and smaller diameter particles are more difficult to be removed with smaller cleaned area. Moreover, particle energy obtained from the shock wave is analyzed through which particle removal trace and cleaned area are studied combined reflection shock wave and irregular turnover of the particle into account.Removal of micron copper particles on a silica surface in air is experimented at different working gap. Results show that particles can be effectively removed within the suitable working gap, i.e., 0.8 mm for 150 mJ explosion energy, and higher working gap represents poorer cleaning efficiency. Moreover, the cleaning situation of the heavy contamination shows out an interesting phenomenon of the cleaned area (0.4cm 2 ) profile that is an ellipse caused by the non-uniform pressure distribution of plasma shock wave.

show abstract

“…The IC miniaturization requires increasing efforts and new concepts to clean wafer surface. Recently, laser cleaning comes up to be a potential efficient method to remove particles from solid substrates [1][2][3][4][5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

<title>Influence of surface morphology on laser cleaning efficiency</title>

Yong

Mai

et al. 1999

SPIE Proceedings

View full text Add to dashboard Cite

Laser cleaning is an effective cleaning method that can be widely used in microelectronic industry.Mechanisms of laser induced removal of particulate contaminants from solid substrates, such as Si wafer, are of great concern. The previous works on laser cleaning are mostly based on perfectly flat surface model, while few of them are objected to the influence of surface morphology. In the IC process, however, the Si surface morphology will change dramatically after few steps of processing, therefore its influence to laser cleaning efficiency is inevitable. In this experiment, the cleaning efficiencies of 2.5 and 1 .0 jtm spherical silica particles from Si with different surface morphologies are investigated. These surfaces were achieved by anisotropic etching of Si wafers in KOH solvent, with etching times raging from 1 minute to 30 minutes. Atomic force microscope (AFM) observation showed the Rp-v roughness of thus-processed Si surfaces ranges from 1 .6nm to 70 nm, and rms roughness ranges from 0. mm to 9.0 urn. For both kinds of particles, the cleaning efficiencies decrease with increasing surface roughness. The possible reason is that the rough surface may buffer the sudden thermal expansion of the substrate, making the particles more difficult to be removed.

show abstract

Shock wave analysis of laser assisted particle removal

Cited by 43 publications

References 11 publications

Interaction of laser-generated surface acoustic pulses with fine particles: Surface cleaning and adhesion studies

Interaction of laser-generated surface acoustic pulses with fine particles: Surface cleaning and adhesion studies

Dynamics of particles removal in laser shock cleaning

<title>Influence of surface morphology on laser cleaning efficiency</title>

Contact Info

Product

Resources

About