Shrinkage behavior of LTCC hetero-laminates

Lim, Won Bae; Cho, Yong Soo; Seo, Young‐Kyo; Park, Jae–Gwan

doi:10.1016/j.jeurceramsoc.2008.07.058

Cited by 17 publications

(9 citation statements)

References 19 publications

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“…This discontinuous shrinkage behavior of the 40-60 wt% CCTO samples is difficult to be fully explained. The flat region of the curves in the temperature range of ∼680 to ∼850 • C may be related to crystallization as reported elsewhere [13]. The sudden stop in the typical TMA curve of the crystallizable glass system is known to be directly associated with the onset temperature of crystallization [13,14].…”

Section: Densification Behaviorsupporting

confidence: 63%

“…The flat region of the curves in the temperature range of ∼680 to ∼850 • C may be related to crystallization as reported elsewhere [13]. The sudden stop in the typical TMA curve of the crystallizable glass system is known to be directly associated with the onset temperature of crystallization [13,14]. It is proposed that densification may not proceed during the active stage of crystallization but resumes with the assistance of residual glass at higher temperatures.…”

Section: Densification Behaviorsupporting

confidence: 61%

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Phase evolution and enhanced dielectric properties of BaO·Nd 2 O 3 ·TiO 2 ·B 2 O 3 glass-based dielectrics containing CaCu 3 Ti 4 O 12

Key¹,

Lee²,

Jung³

et al. 2012

Journal of Alloys and Compounds

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Section: Densification Behaviorsupporting

confidence: 63%

Section: Densification Behaviorsupporting

confidence: 61%

Phase evolution and enhanced dielectric properties of BaO·Nd 2 O 3 ·TiO 2 ·B 2 O 3 glass-based dielectrics containing CaCu 3 Ti 4 O 12

Key¹,

Lee²,

Jung³

et al. 2012

Journal of Alloys and Compounds

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“…The LTCC materials are crystallizable glass ceramics in which sintering is controlled by the viscous flow . Commonly reported apparent activation energies for the densification of LTCC materials are in the range of 400–700 kJ/mol . Q a s’ in the range of 215–235 kJ/mol are reported for the liquid‐phase sintered PZT ceramics doped with 1 wt% LiBiO 2 and 0.06 wt% CuO .…”

Section: Resultsmentioning

confidence: 99%

Sintering Behavior, Properties, and Applications of Co‐Fired Piezoelectric/Low Temperature Co‐Fired Ceramic (PZT‐SKN/LTCC) Multilayer Ceramics

Zhang

Eitel

2012

Int J Applied Ceramic Tech

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Materials and processing conditions have been developed allowing co‐firing of fluxed PZT‐SKN materials with commercial low temperature co‐fired ceramic (LTCC) tapes. Previously, Pb(Zr0.53, Ti0.47)O3–Sr(K0.25, Nb0.75)O3 (PZT‐SKN) ceramics fluxed with 1 wt% LiBiO2 and 1 wt% CuO addition were shown to sinter to high density at 900°C for 1 h, with a large d33 piezoelectric coefficient of ~415 pm/V. Currently, the master sintering curve (MSC) approach has been used to study the densification behaviors of fluxed PZT‐SKN and LTCC tapes. Different sintering mechanisms for fluxed PZT‐SKN ceramics and LTCC materials are confirmed by analyzing the apparent activation energy (Qa). Using knowledge gained from MSC results, an optimized sintering profile was developed. Multilayer PZT‐SKN/HL2000 (HeraLock™ Tape, Heraeus) stacks co‐fired at 900°C for 0.5 h maintain large piezoelectric coefficient (high field d33 > 340 pm/V). EDS analysis reveal limited interdiffusion of Pb from PZT‐SKN layers in LTCC and the appearance of Al, Ca, and Si in the PZT‐SKN near the PZT‐SKN/LTCC interface. Further, elemental interdiffusion was not detected at the center of piezoelectric layer in PZT‐SKN/LTCC multilayer ceramics and no subsequent reduction in piezoelectric coefficient d33 was observed. Finally, a piezoelectric microbalance with mass sensitivity of 150 kHz/mg was fabricated using the materials and methods developed.

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“…A total of seven square sheets were stacked onto a metal die, and then laminated at a lamination pressure of ~10 MPa at 70°C. The casting and lamination process is a typical one for LTCC as described elsewhere . The laminated stack was fired at a fixed temperature of 850°C for 30 min.…”

Section: Methodsmentioning

confidence: 99%

Silicon Carbide Whisker‐Reinforced Ceramic Tape for High‐Power Components

Doo

Lim

Lee

et al. 2013

Int J Applied Ceramic Tech

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An attempt to enhance both mechanical strength and thermal conductivity of glass-based tapes is described. Flexural strength of~420 MPa and thermal conductivity of~10.3 W/m/K have been achieved in fully densified tape comprising calcium aluminoborosilicate glass, aluminum nitride, and silicon carbide whiskers. Silicon carbide whiskers aligned parallel to the casting direction contributed significantly to the reinforcement of the microstructure with accompanying extensive densification over a broad temperature range. These results are compared with the more typical alumina filler substituted for the aluminum nitride.

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Shrinkage behavior of LTCC hetero-laminates

Cited by 17 publications

References 19 publications

Phase evolution and enhanced dielectric properties of BaO·Nd 2 O 3 ·TiO 2 ·B 2 O 3 glass-based dielectrics containing CaCu 3 Ti 4 O 12

Phase evolution and enhanced dielectric properties of BaO·Nd 2 O 3 ·TiO 2 ·B 2 O 3 glass-based dielectrics containing CaCu 3 Ti 4 O 12

Sintering Behavior, Properties, and Applications of Co‐Fired Piezoelectric/Low Temperature Co‐Fired Ceramic (PZT‐SKN/LTCC) Multilayer Ceramics

Silicon Carbide Whisker‐Reinforced Ceramic Tape for High‐Power Components

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