Si Characterization on Thinning and Singulation Processes for 2.5/3D HBM Package Integration
MiKyeong Choi,
SeaHwan Kim,
TaeJoon Noh
et al.
Abstract:As stacking technologies, such as 2.5D and 3D packages, continue to accelerate in advanced semiconductor components, the singulation and thinning of Si wafers are becoming increasingly critical. Despite their importance in producing thinner and more reliable Si chips, achieving high reliability remains a challenge, and comprehensive research on the effects of these processing techniques on Si chip integrity is lacking. In this study, the impacts of wafer thinning and singulation on the fracture strength of Si … Show more
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