SiC/Cu composites with tungsten coating prepared by powder metallurgy

Gan, K. K.; Chen, N.; Wang, Y.; Gu, Meizhuan

doi:10.1179/174328407x158532

Cited by 16 publications

(5 citation statements)

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Al and Cu-based MMCs exhibit excellent thermal and mechanical properties, making them widely used in electronic packaging [44,45]. The reinforcement materials mainly include Al 2 O 3 , SiC, AlN, among which SiC is extensively utilized due to its CTE (approximately 4 × 10 −6 K −1 ) and relatively lower price [44][45][46][47][48][49].…”

Section: Current Status Of Metal-based Electronic Packaging Materialsmentioning

confidence: 99%

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Lai

Niu

et al. 2023

Micromachines

View full text Add to dashboard Cite

With the advancement of semiconductor technology, chip cooling has become a major obstacle to enhancing the capabilities of power electronic systems. Traditional electronic packaging materials are no longer able to meet the heat dissipation requirements of high-performance chips. High thermal conductivity (TC), low coefficient of thermal expansion (CTE), good mechanical properties, and a rich foundation in microfabrication techniques are the fundamental requirements for the next generation of electronic packaging materials. Currently, metal matrix composites (MMCs) composed of high TC matrix metals and reinforcing phase materials have become the mainstream direction for the development and application of high-performance packaging materials. Silicon carbide (SiC) is the optimal choice for the reinforcing phase due to its high TC, low CTE, and high hardness. This paper reviews the research status of SiC-reinforced aluminum (Al) and copper (Cu) electronic packaging materials, along with the factors influencing their thermo-mechanical properties and improvement measures. Finally, the current research status and limitations of conventional manufacturing methods for SiC-reinforced MMCs are summarized, and an outlook on the future development trends of electronic packaging materials is provided.

show abstract

Section: Current Status Of Metal-based Electronic Packaging Materialsmentioning

confidence: 99%

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Lai

Niu

et al. 2023

Micromachines

View full text Add to dashboard Cite

show abstract

“…However, the effective skin depth of MoO 3 and doped SiC is only 30% greater then Mo; i.e., the quality factor is 30% lower-a reduction value tolerable for common accelerating structures. A possible alternative to these single materials is represented by the growth of multilayers obtained by combining a metallic material (such as W and Mo [13]) with a thin semiconductor layer (e.g., SiC) in order to improve thermal strength and mechanical properties.…”

Section: Materials and Methods Of Depositionmentioning

confidence: 99%

An Analytical Model for Evaluation of the Properties of Metallic Coatings in RF Structures

et al. 2016

View full text Add to dashboard Cite

A simple analytic model based on the equations of the propagation matrices theory has been developed in order to evaluate the effective skin depth of coated metallic surfaces. With particular attention to the R&D of highly-performing accelerating structures, different thick coatings with excellent mechanical and electrical properties have been considered such as molybdenum and its oxides, p-doped SiC, and TiN. Calculations show that copper coated with a p-type SiC may exhibit an improved hardness and a higher thermal resistance. Combined with experimental tests, this study may support the identification of reliable multilayers capable of improving the higher power performance of radio-frequency (RF) structures in terms of the accelerating gradient in order to increase the resistance to the high thermal stress of structures made with copper.

show abstract

“…K.K.can had acquired SiC-Cu composites with tungsten coating prepared by powder coating. The relative density of the composite was nearly 98% when the volume of SiC was 15% [12]. Shi Xiaoliang had fabricated W-20Cu alloy reinforced by titanium nitride coated SiC(less than 1wt%) fibers by using SPS process at 1200°C and investigated the microstructure and properties of the composites [13].…”

Section: Introductionmentioning

confidence: 99%

Fabrication and Properties of W-SiC<sub>P</sub>/Cu Composites by Hot Pressing Sintering

Zhang

Liu

Zhang

et al. 2016

KEM

View full text Add to dashboard Cite

Abstract. A new ternary composite of W-SiCP/Cu(40vol%) was designed and prepared by low-temperature hot-press sintering. The micro-structural characterizations were evaluated by X-ray diffraction (XRD) and scanning electron microstructure (SEM), coefficient of thermal expansion is measured. When sintered at 950°C-100MPa-2h, the relative density of the W-SiCP/Cu composites as a function of W content all exceeded 97%. Due to the plastic deformation of Cu, higher densification W-SiCP/Cu(40vol%) composites can be achieved at a relatively low temperature. The composites are characterized by the relatively low coefficient of thermal expansion, bending strength and hardness. The values of thermal expansion indicate that thermal expansion can be precisely controlled by adding SiC particles.

show abstract

SiC/Cu composites with tungsten coating prepared by powder metallurgy

Cited by 16 publications

References 21 publications

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

An Analytical Model for Evaluation of the Properties of Metallic Coatings in RF Structures

Fabrication and Properties of W-SiC<sub>P</sub>/Cu Composites by Hot Pressing Sintering

Contact Info

Product

Resources

About