Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control

Fan, Jun; Hardock, Andreas; Rimolo-Donadío, Renato; Müller, Sebastian; Kwark, Young; Schuster, Christian

doi:10.1109/memc.2014.6798802

Cited by 31 publications

(4 citation statements)

References 20 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…3 (c). These vertical interconnections adjust the return current path length on the ground plane, functioning as a series inductance in the feeding network [17]. The inductance values are modified according to the positions of the via posts (D1, D2).…”

Section: B Evolution Processmentioning

confidence: 99%

Dual-Band Patch Antenna Matching Network Comprised of Separated Ground Layers and via Posts for Adjustable Return Current Path

et al. 2022

View full text Add to dashboard Cite

This paper proposes a dual-band antenna impedance matching network concept that features identical radiation characteristics. The concept is exemplified for millimeter-wave mobile devices but can be scaled to lower and higher frequency spectrum. The method is deduced through an introduction of an additional matching network consisting of inductive distributed elements to formulate adjustable return current paths. This is realized using fragmented ground plane and a series of vias. No modification of the antenna radiating element is required. This new class of matching network enables independent adjustment of the resonance frequencies while maintaining nearly-identical radiation patterns at both frequencies. For experimental verifications, the proposed antenna impedance matching network is fabricated using a lowtemperature co-fired ceramic process. The measurement of this single element exhibits dual-band operations at 28.0 GHz and 39.0 GHz, obtaining the realized gain of 5.15 dBi and 5.42 dBi, respectively. In addition, a 1×4 phased array antenna is devised and studied to validate beamforming performances at both frequencies. With the integration of the beamforming circuit, a reconfigurable beamforming is demonstrated at 28.0 GHz, in which the peak measured gain is 10.83 dBi. At the second resonance frequency (39.0 GHz), a passive feeding network is employed to evaluation its beam scanning abilities, and the main beam peak realized gain of 10.40 dBi is ascertained. The result can be extended to any other frequencies while maintaining nearidentical far-field characteristics.

show abstract

Section: B Evolution Processmentioning

confidence: 99%

Dual-Band Patch Antenna Matching Network Comprised of Separated Ground Layers and via Posts for Adjustable Return Current Path

et al. 2022

View full text Add to dashboard Cite

show abstract

“…They provided the return current paths between ground plane pairs; studies had found that the insertion loss of the signal could be improved by these ground vias. In the discussion of [13], six ground vias were placed near the signal via to eliminate the via-plane coupling, and a physics-based equivalent circuit modeling approach [14,15] was introduced for the ancillary study. Those studies were based on the theoretical model at a low frequency band.…”

Section: Introductionmentioning

confidence: 99%

A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

2016

International Journal of Antennas and Propagation

View full text Add to dashboard Cite

This paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via. This design has been proposed for a multilayer substrate package. The matching pads, which are located in the center of the signal via on each ground layer, are adopted to further improve the impedance matching level and thus attain better signal transition performance. A physics-based equivalent circuit modeling approach has been employed for this research. The right angle MS-to-MS via transition was also designed using this technique. The simulatedS-parameters indicate that the match-pad design made a breakthrough in achieving an approximate −15 dB wide-band return loss reduction. The measuredS-parameter of MS-to-MS transition showed that return loss with the matching pads is better than that without the matching pads.

show abstract

“…In particular, high-speed interconnect design is one of the crucial parts of real IC-package design, which is the focus of this study. The reason why it is critical is that the use of high-speed interconnect in the state-of-the-art IC package dramatically increases; however, its analysis and optimization method become more difficult and less efficient [3][4][5].As the data rate and density of the IC-package interconnect increase, the effects of parasitics such as mutual capacitance, mutual inductance, and the skin effect cannot be ignored. In the simulation, a broadband interconnect model must be adopted to successfully capture the high-frequency effect of parasitics and accurately analyze various electrical characteristics, as shown in Figure 1.…”

mentioning

confidence: 99%

mentioning

confidence: 99%

Efficient Approach for Electrical Design and Analysis of High-Speed Interconnect in Integrated Circuit Packages

Kim

Kong

2020

Electronics

View full text Add to dashboard Cite

In recent integrated circuit (IC) packages, the structure of the interconnect is highly complex, and the effect of high-frequency parasitics is significant. These factors increase the number and level of design variables and extend the analysis frequency range to tens of gigahertz. As a result of the high dimensions of the design space, it is difficult to reduce the design gap between the current design approach and the physical limits of the practical IC-package interconnect. In this paper, we present an efficient approach for designing and analyzing the electrical characteristics of the high-speed interconnect in IC packages. The proposed approach is developed using a hybrid method involving the design of experiments, the domain decomposition method, and the finite-element method. We present a procedure to identify critical design variables for the IC-package interconnect, and we derive a method to recombine the impedance parameters of a segmented interconnect. The proposed hybrid method is verified by comparing its characteristic impedance (Z o ) with the Z o value from a full-wave simulation of a complete interconnect. We demonstrate that the proposed hybrid method significantly reduces the design space of the IC-package interconnect so that we can efficiently and rapidly obtain the optimized solution, thereby improving the system performance.Electronics 2020, 9, 303 2 of 15 A difficulty in IC-package design is that the results of the electrical and thermomechanical designs are affected by each other, as they share common design variables, necessitating a tradeoff design. To efficiently obtain an optimized solution for both designs, a multiphysics simulation scheme is preferred; however, such a scheme is not suitable for the development of practical applications [1,2]. During industrial developments of an IC package, thermomechanical and electrical engineers separately perform simulations and analyses for their own goals and iteratively modify their designs by communicating with each other. It is time-consuming to optimize a tradeoff design, because both the electrical and thermomechanical characteristics are predicted via computationally expensive methods.Additionally, the package types are continuously evolving into complex multichip packages such as the embedded multimedia card, the embedded multichip package, and universal flash storage. From the viewpoint of electrical design, these package types significantly increase the difficulty of IC-package design, because they employ high-density ICs vertically and horizontally stacked in the package substrate, as well as differential interconnects of SERDES devices for high-speed IC communications. In particular, high-speed interconnect design is one of the crucial parts of real IC-package design, which is the focus of this study. The reason why it is critical is that the use of high-speed interconnect in the state-of-the-art IC package dramatically increases; however, its analysis and optimization method become more difficult and less efficient [3][4][5].As the...

show abstract

Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control

Cited by 31 publications

References 20 publications

Dual-Band Patch Antenna Matching Network Comprised of Separated Ground Layers and via Posts for Adjustable Return Current Path

Dual-Band Patch Antenna Matching Network Comprised of Separated Ground Layers and via Posts for Adjustable Return Current Path

A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

Efficient Approach for Electrical Design and Analysis of High-Speed Interconnect in Integrated Circuit Packages

Contact Info

Product

Resources

About