Significant Hall–Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration

Kao, Yu-Jyun; Li, Yu-Ju; Shen, Yu-An; Chen, Chih‐Ming

doi:10.1038/s41598-023-27669-2

Cited by 13 publications

(3 citation statements)

References 31 publications

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“…The Hall-Petch relationship is usually used to determine the relationship between hardness and crystallite size [59][60][61][62]. Regarding crystallite size values, deformation mechanisms in polycrystalline copper can be categorized into three groups: (1) grain shearing and pile-up at grain borders (grain size greater than or equal to 100 nm); (2) shockley (or lattice) partial dislocations (grain sizes between 10 and 100 nm); and (3) grain boundary sliding (grain sizes less than around 10 nm) [59].…”

Section: Discussionmentioning

confidence: 99%

Hardness and Wettability Characteristics of Electrolytically Produced Copper Composite Coatings Reinforced with Layered Double Oxide (Fe/Al LDO) Nanoparticles

Sasi Maoloud Mohamed,

Nikolić,

Vuksanović

et al. 2024

Coatings

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The lab-made ferrite-aluminium layered double oxide (Fe/Al LDO) nanoparticles were used as reinforcement in the production of copper matrix composite coatings via the electrodeposition route in this study. The Cu coatings electrodeposited galvanostatically without and with low concentrations of Fe/Al LDO nanoparticles were characterized by SEM (morphology), AFM (topography and roughness), XRD (phase composition and texture), Vickers microindentation (hardness), and the static sessile drop method (wettability). All Cu coatings were fine-grained and microcrystalline with a (220) preferred orientation, with a tendency to increase the grain size, the roughness, and this degree of the preferred orientation with increasing the coating thickness. The cross-section analysis of coatings electrodeposited with Fe/Al LDO nanoparticles showed their uniform distribution throughout the coating. Hardness analysis of Cu coatings performed by application of the Chicot-Lesage (C-L) composite hardness model showed that Fe/Al LDO nanoparticles added to the electrolyte caused a change of the composite system from “soft film on hard cathode” into “hard film on soft cathode” type, confirming the successful incorporation of the nanoparticles in the coatings. The increase in roughness had a crucial effect on the wettability of the coatings, causing a change from hydrophilic reinforcement-free coatings to hydrophobic coatings obtained with incorporated Fe/Al LDO nanoparticles.

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Section: Discussionmentioning

confidence: 99%

Hardness and Wettability Characteristics of Electrolytically Produced Copper Composite Coatings Reinforced with Layered Double Oxide (Fe/Al LDO) Nanoparticles

Sasi Maoloud Mohamed,

Nikolić,

Vuksanović

et al. 2024

Coatings

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“…The surface profiles of the two Cu electroplated layers were also analyzed using a profilometer, as shown in Figure 1c,d, and the results were consistent with the top-view SEM observations. Such a significant morphological change is attributed to the synergistic effect generated by the interactions between the suppressor and accelerator molecules being simultaneously adsorbed on the Cu surface, which regulates the atomic deposition [29,[32][33][34]. The grain size distribution was not uniform in the two Cu electroplated layers, as shown in Figure 2c,d.…”

Section: Effects Of Additives On Co-deposition Of Impurities In Elect...mentioning

confidence: 99%

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Li,

Yen,

Chen

2024

Materials

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Sn-3Ag-0.5Cu (SAC305)- and Sn-9Zn-based alloys (Sn-Zn-X, X = Al, In) are lead-free solders used in the fabrication of solder joints with Cu metallization. Electroplating is a facile technology used to fabricate Cu metallization. However, the addition of functional additive molecules in the plating solution may result in impurity residues in the Cu electroplated layer, causing damage to the solder joints. This study investigates the impurity effect on solder joints constructed by joining various solder alloys to the Cu electroplated layers. Functional additives are formulated to fabricate high-impurity and low-impurity Cu electroplated samples. The as-joined solder joint samples are thermally aged at 120 °C and 170 °C to explore the interfacial reactions between solder alloys and Cu. The results show that the impurity effect on the interfacial reactions between SAC305 and Cu is significant. Voids are massively formed at the SAC305/Cu interface incorporated with a high impurity content, and the Cu6Sn5 intermetallic compound (IMC) grows at a faster rate. In contrast, the growth of the Cu5Zn8 IMC formed in the SnZn-based solder joints is not significantly influenced by the impurity content in the Cu electroplated layers. Voids are not observed in the SnZn-based solder joints regardless of the impurity content, indicative of an insignificant impurity effect. The discrepancy of the impurity effect is rationalized by the differences in the IMC formation and associated atomic interdiffusion in the SAC305- and SnZn-based solder joints.

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“…Nanocrystalline copper can also achieve Cu-Cu direct bonding to obtain a high-strength bonding interface. [23][24][25] Therefore, three types of copper, including copper with equiaxed grains (EG Cu), copper with columnar nanotwinned grains (C-NT Cu), and copper with mixed equiaxed and columnar grains (MG Cu), were chosen as the main objects of this study. They were electroplated on the patterns of pads and RDLs in a series of dimensions to study their size sensitivity.…”

Section: Introductionmentioning

confidence: 99%

Influence of Macroscale Dimension on the Electrocrystallization of Cu Pad and Redistributed Layer in Advanced Packaging

Liu,

Wan,

Gao

et al. 2024

Adv Eng Mater

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Equiaxed copper (EG Cu), copper with columnar nanotwinned grains (C‐NT Cu), and copper with mixed equiaxed and columnar grains (MG Cu) were electroplated on pads and redistributed layers (RDLs) with different dimensions. When the diameters of pads increased from 40 μm to 105 μm, the flatness of pads decreased from 34.5% to 24.0%. And the flatness gradually deteriorated from 16.5 % to 34.4 % with the increase of RDL width from 8 μm to 20 μm. In contrast, the flatness of C‐NT Cu and MG Cu fluctuated between 1 % and 5 %, showing a weak correlation on the dimension. In terms of microstructure, the EG Cu and MG Cu had a weak correlation with size change, and the grain orientation showed a randomness. However, the (111) texture component of C‐NT Cu differed greatly with different dimensions, especially in transition layer. The (111) texture component changed from 9.6% to 38.1% for ϕ 40‐105 μm pad, and from 14.3% to 18.9% for 8‐20 μm wide RDL. The study reveals the significant size effect on the deposited profile and microstructure of electrodeposited copper materials, which should give insights of the materials design in advanced packaging technology.This article is protected by copyright. All rights reserved.

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Significant Hall–Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration

Cited by 13 publications

References 31 publications

Hardness and Wettability Characteristics of Electrolytically Produced Copper Composite Coatings Reinforced with Layered Double Oxide (Fe/Al LDO) Nanoparticles

Hardness and Wettability Characteristics of Electrolytically Produced Copper Composite Coatings Reinforced with Layered Double Oxide (Fe/Al LDO) Nanoparticles

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Influence of Macroscale Dimension on the Electrocrystallization of Cu Pad and Redistributed Layer in Advanced Packaging

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