Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

“…The differential in temperature encourages atom diffusion and grain development. According to widespread consensus [29] , the Ni 3 Sn 4 layer at the Ni/Sn interface serves as a diffusion barrier layer, but the presence of a temperature gradient may effectively reduce the barrier effect and encourage the diffusion of Ni atoms from the Ni skeleton into Sn solder [12] , [30] .…”