2023
DOI: 10.1134/s1560090423700768
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Silica Loaded Binary Epoxy Resins Cured by an Imide–Amine Hardener Suitable for Preparing Transparent and Flexible Coatings

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Cited by 2 publications
(2 citation statements)
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“…When the resin reached the maximum modulus value, it indicated that the resin was fully cured and the condensation was complete [ 42 , 43 ]. As shown in Figure 8 , the temperature at which the pure PF resin completed condensation was 173 °C.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…When the resin reached the maximum modulus value, it indicated that the resin was fully cured and the condensation was complete [ 42 , 43 ]. As shown in Figure 8 , the temperature at which the pure PF resin completed condensation was 173 °C.…”
Section: Resultsmentioning
confidence: 99%
“…It could be seen from Figure 8 that the slopes of the DMA curves for PFC resins with HBP-NH 2 addition were higher than that of pure PF resin, indicating that the addition of HBP-NH 2 can promote the rapid curing of PF resin between wood strips. When the resin reached the maximum modulus value, it indicated that the resin was fully cured and the condensation was complete [42,43]. As shown in Figure 8, the temperature at which the pure PF resin completed condensation was 173 • C. The PFC1 and PFC5 resins were basically below 173 • C, which was lower than the PF resin.…”
Section: Dma Analysismentioning
confidence: 97%