“…Chemical vapor-deposited silicon ceramic films are prepared by gas-phase reactions containing a silicon compound, for example as silane (SiH 4 ) or silicon tetrachloride (SiCl 4 ), and a nitrogen, carbon, or boron precursor, for example, ammonia in case of silicon nitride (Si 3 N 4 ) formation [1]. Such ceramic films or particles have significant advantages such as extreme hardness, oxidation inertness, and mechanical strength at high temperature, and are extensively used for electronic and nonelectronic (coatings, thermal insulation, combustion chambers, etc .…”