2021
DOI: 10.1109/access.2021.3080505
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Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling

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Cited by 14 publications
(1 citation statement)
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“…In terms of power circuit simplicity 2LMV approach is the most convenient, the parasitic inductance and switching conditions are as good as the module packaging [35,36] and busbar design [28]. As recent SiC MOSFET modules are improved compared to previous versions and the layout of this half-bridge is not challenging, the results in Fig.…”
Section: B Power Layout -Parasitic Inductancesmentioning
confidence: 99%
“…In terms of power circuit simplicity 2LMV approach is the most convenient, the parasitic inductance and switching conditions are as good as the module packaging [35,36] and busbar design [28]. As recent SiC MOSFET modules are improved compared to previous versions and the layout of this half-bridge is not challenging, the results in Fig.…”
Section: B Power Layout -Parasitic Inductancesmentioning
confidence: 99%