2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) 2020
DOI: 10.1109/mems46641.2020.9056213
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Silicon-Chip Based Electromagnetic Vibration Energy Harvesters Rapidly Fabricated by Wafer-Level Molten Metal Micro-Casting Technique

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Cited by 6 publications
(2 citation statements)
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“…Energy harvesters can be categorized by a generating mechanism such as a piezoelectric (PE) energy harvester [ 8 ], piezo-electromagnetic (PEM) hybrid energy harvester [ 9 ], electrostatic (ES) energy harvester [ 10 , 11 ], electromagnetic (EM) energy harvester [ 12 , 13 , 14 , 15 ], thermoelectric generator (TEG) [ 16 ], triboelectric nanogenerator (TENG) [ 17 ], pyroelectric generator [ 18 , 19 ], thermal radiation pyroelectric generator (PyG) [ 20 , 21 ], etc. Among these energy harvesters, EM energy harvesters can easily convert relative motion between a metal coil and magnet into electronic energy, and the output power density is relatively high.…”
Section: Introductionmentioning
confidence: 99%
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“…Energy harvesters can be categorized by a generating mechanism such as a piezoelectric (PE) energy harvester [ 8 ], piezo-electromagnetic (PEM) hybrid energy harvester [ 9 ], electrostatic (ES) energy harvester [ 10 , 11 ], electromagnetic (EM) energy harvester [ 12 , 13 , 14 , 15 ], thermoelectric generator (TEG) [ 16 ], triboelectric nanogenerator (TENG) [ 17 ], pyroelectric generator [ 18 , 19 ], thermal radiation pyroelectric generator (PyG) [ 20 , 21 ], etc. Among these energy harvesters, EM energy harvesters can easily convert relative motion between a metal coil and magnet into electronic energy, and the output power density is relatively high.…”
Section: Introductionmentioning
confidence: 99%
“…This paper proposes double-deck three-dimensional (3D) metal solenoids that are fabricated with a silicon-wafer based integration method and can generate much larger power density than single-layer solenoid structure [ 13 ]. A silicon mold for the 3D metal solenoid with double-deck metal coils is firstly fabricated by micro electro mechanical systems (MEMS) techniques including through-wafer deep reactive ion etch (DRIE).…”
Section: Introductionmentioning
confidence: 99%