Silicon MEMS inertial sensors evolution over a quarter century

Langfelder, Giacomo; Bestetti, Marco; Gadola, Marco

doi:10.1088/1361-6439/ac0fbf

Cited by 58 publications

(27 citation statements)

References 164 publications

(177 reference statements)

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“…The capacitive-based microelectromechanical systems (MEMS) accelerometer, as a typical inertial sensor, has been widely used in consumer electronics, industrial applications, and inertial navigation [ 1 , 2 , 3 ]. However, performance shortages remain a bottleneck for further applications.…”

Section: Introductionmentioning

confidence: 99%

Design of a Capacitive MEMS Accelerometer with Softened Beams

et al. 2022

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Lower stiffness can improve the performance of capacitive-based microelectromechanical systems sensors. In this paper, softened beams, achieved by the electrostatic assembly approach, are proposed to lower the stiffness of a capacitive MEMS accelerometer. The experiments show that the stiffness of the accelerometer is reduced by 43% with softened beams and the sensitivity is increased by 72.6%. As a result, the noise of the accelerometer is reduced to 26.2 μg/√Hz with an improvement of 44.5%, and bias instability is reduced to 5.05 μg with an enhancement of 38.7%. The electrostatic assembly-based stiffness softening technique is proven to be effective and can be used in many types of MEMS devices.

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Section: Introductionmentioning

confidence: 99%

Design of a Capacitive MEMS Accelerometer with Softened Beams

et al. 2022

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“…Microelectromechanical system (MEMS) Coriolis Vibratory Gyroscopes have been an increasingly significant inertial sensor due to their small size, light weight, low cost and high-density integration in recent years [ 1 ]. They have been employed widely in many applications, including balancing and aiming in consumer electronics [ 2 ], self-localization in autonomous vehicles [ 3 ], rotation angle detection in industrial automatic robots [ 4 ], medical equipment [ 5 ], and aerospace navigation [ 6 ].…”

Section: Introductionmentioning

confidence: 99%

Online Compensation of Phase Delay Error Based on P-F Characteristic for MEMS Vibratory Gyroscopes

Liu

Qin

2022

Micromachines

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In this paper, an online compensation method of phase delay error based on a Phase-Frequency (P-F) characteristic has been proposed for MEMS Coriolis Vibratory Gyroscopes (CVGs). At first, the influences of phase delay were investigated in the drive and sense mode. The frequency response was acquired in the digital control system by collecting the demodulation value of drive displacement, which verified the existence and influence of the phase delay. In addition, based on the P-F characteristic, that is, when the phase shift of the nonresonant drive force through the resonator is almost 0° or 180°, the phase delay of the gyroscope is measured online by injecting a nonresonant reference signal into the drive-mode dynamics. After that, the phase delay is self-corrected by adjusting the demodulation phase angle without affecting the normal operation of the gyroscopes. The approach was validated with an MEMS dual-mass vibratory gyroscope under double-loop force-to-rebalance (in-phase FTR and quadrature FTR) closed-loop detection mode and implemented with FPGA. The measurement results showed that this scheme can detect and compensate phase delay to effectively eliminate the effect of the quadrature error. This technique reduces the zero rate output (ZRO) from −0.71°/s to −0.21°/s and bias stability (BS) from 23.30°/h to 4.49°/h, respectively. The temperature sensitivity of bias output from −20 °C to 40 °C has reached 0.003 °/s/°C.

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“…Monocrystalline Silicon is an important structural and optical material [1] and is broadly used in micro/nanoelectromechanical systems [2]. It has a typically fragile behavior at room temperature and atmospheric pressure [3].…”

Section: Introductionmentioning

confidence: 99%

Mapping ductile-to-fragile transition and the effect of tool nose radius in diamond turning of single-crystal silicon

Dib

Otoboni

Jasinevicius

2022

Int J Adv Manuf Technol

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Although it has long been known that tools with more negative rake angles allow the ductile regime to be achieved when machining monocrystalline silicon; little has been discussed about the tool-material interaction in terms of the microgeometric contact of the tool tip at this interface. In this paper, the tool rake angle was varied in order to change the undeformed chip thickness value once the tool cutting radius, formed in front of the tool rake face, changes when the tool rake angle becomes more negative. Based on the statistical design of the experiment applied to cutting tests, a map relating values of transition pressure and different crystallographic directions is built to assist in determining machining conditions with a ductile response within a wider spectrum based on tool rake angle under different machining conditions. The results obtained allowed to answer questions under which machining conditions and tool geometry account for better surface finishes, lower machining forces, and lower residual stresses. The response surfaces generated provided answers capable of establishing under which cutting radii yielded more ductile mode material removal and avoided a brittle response, related to anisotropic response due to change in the crystallographic direction. Finally, we used the brittle-to-ductile transition map to determine a more suitable machining condition to diamond turn Fresnel lenses in single crystal silicon.

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Silicon MEMS inertial sensors evolution over a quarter century

Cited by 58 publications

References 164 publications

Design of a Capacitive MEMS Accelerometer with Softened Beams

Design of a Capacitive MEMS Accelerometer with Softened Beams

Online Compensation of Phase Delay Error Based on P-F Characteristic for MEMS Vibratory Gyroscopes

Mapping ductile-to-fragile transition and the effect of tool nose radius in diamond turning of single-crystal silicon

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