Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging

Dixit, Pradeep; Lin, Nay; Miao, Jianmin; Wong, Wai Kwan; Choon, Teo Kiat

doi:10.1016/j.sna.2007.09.006

Cited by 36 publications

(12 citation statements)

References 27 publications

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“…Bulk micromachining of metals and semiconductors has been widely investigated and developed in the fields of electronic devices, micromachining, and nanotechnology [1][2][3][4][5]. Aluminum is generally used for circuit materials, cold plates, and heat sinks due to its low electrical resistivity (2.66 x 10 -8 Ωm) and high thermal conductivity (237 Wm -1 K -1 ) [6], and it is important to develop more precise and smaller bulk micromachining of aluminum for micro-and nano-structure fabrication.…”

Section: Introductionmentioning

confidence: 99%

Aluminum bulk micromachining through an anodic oxide mask by electrochemical etching in an acetic acid/perchloric acid solution

Kikuchi

Wachi

Sakairi

et al. 2013

Microelectronic Engineering

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A well-defined microstructure with microchannels and a microchamber was fabricated on an aluminum plate by four steps of a new aluminum bulk micromachining process: anodizing, laser irradiation, electrochemical etching, and ultrasonication. An aluminum specimen was anodized in an oxalic acid solution to form a porous anodic oxide film. The anodized aluminum specimen was irradiated with a pulsed Nd-YAG laser to locally remove the anodic oxide film, and then the exposed aluminum substrate was selectively dissolved by electrochemical etching in an acetic acid / perchloric acid solution. The anodic oxide film showed good insulating properties as a resist mask during electrochemical etching in the solution. A hemicylindrical microgroove with thin free-standing anodic oxide on the groove was fabricated by electrochemical etching, and the groove showed a smooth surface with a calculated mean roughness of 0.2 -0.3 µm. The free-standing oxides formed by electrochemical etching were easily removed from the specimen by ultrasonication in an ethanol solution. Microchannels 60 µm in diameter and 25 µm in depth connected to a microchamber were successfully fabricated on the aluminum.

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Section: Introductionmentioning

confidence: 99%

Aluminum bulk micromachining through an anodic oxide mask by electrochemical etching in an acetic acid/perchloric acid solution

Kikuchi

Wachi

Sakairi

et al. 2013

Microelectronic Engineering

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“…With the individual advantages of using microchannel heat sinks and introducing NW on the surfaces, it is of great interest to combine the nanostructures onto the surfaces of microchannel heat sink for further enhancing the heat transfer performance. Dixit et al [12] presented a multilayered water cooled microchannel heat sink where silicon (Si) nanopillars were grown on the bottom walls of the microchannels by utilizing the micromasking effects in deep reactive ion etching (DRIE). The thermal performance of the heat sink was evaluated by developing a simple thermal resistance model and compared with a heat sink without the nanopillars.…”

Section: Introductionmentioning

confidence: 99%

Pool Boiling Heat Transfer Enhancement Through Nanostructures on Silicon Microchannels

Yao

Kandlikar

2012

Journal of Nanotechnology in Engineering and Medicine

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Uniform silicon nanowires (SiNW) were successfully fabricated on the top, bottom, and sidewall surfaces of silicon microchannels by using a two-step electroless etching process. Different microchannel patterns with the channel width from 100 to 300 μm were first fabricated in a 10 mm × 10 mm silicon chip and then covered by SiNW with an average height of 10–20 μm. The effects of the microchannel geometry, micro/nano-hierarchical structures on pool boiling were studied and the bubble dynamics on different sample surfaces were compared. It was found that the combination of the micro/nanostructures promoted microbubble emission boiling under moderate heat fluxes, and yielded superior boiling heat transfer performance. At given wall superheats, the maximum heat flux of the microchannel with SiNW was improved by 120% over the microchannel-only surface, and more than 400% over a plain silicon surface. These results provide a new insight into the boiling mechanism for micro/nano-hierarchical structures and demonstrate their potential in improving pool boiling performance for microchannels.

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“…The applicability of 1D nanostructures in microchannel heat sink for enhanced thermal performance is yet to be realized. Only two experimental (Dietz, C.R., 2007;Khanikar, V. et al, 2009) and one numerical work (Dixit, P. et al, 2008) have been reported from which no clear conclusion can be drawn on enhancement potential of 1D nanostructures. Carbon nanotubes (CNTs) coated singe phase (Dietz, C.R., 2007) and two phase microchannel (Khanikar, V. et al, 2009) shows reduced thermal performance compared to bare/uncoated microchannel heat sink.…”

mentioning

confidence: 99%

“…Only enhancement (approximately 16%) reported in single phase microchannels is the Si nanopillars based multilayered heat sink (Dixit, P. et al, 2008) but still lacks experimental evidence. In their work, Dixit et al presented a multilayered water cooled microchannel heat sink concept where Si nanopillars are grown in the microchannels by utilizing the micromasking effects in deep reactive ion etching (DRIE).…”

mentioning

confidence: 99%

Thermohydraulic Characteristics of a Single-Phase Microchannel Heat Sink Coated With Copper Nanowires

Li¹,

Ali²,

Yang³

et al. 2011

Frontiers in Heat and Mass Transfer

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This study experimentally investigates single phase heat transfer and pressure drop characteristics of a shallow rectangular microchannel heat sink whose surface is enhanced with copper nanowires (CuNWs). The hydraulic diameter of the channel is 672 μm and the bottom wall is coated with Cu nanowires (CuNWs) of 200 nm in diameter and 50 μm in length. CuNWs are grown on the Cu heat sink by electrochemical synthesis technique which is inexpensive and readily scalable. The heat transfer and pressure drop results of CuNWs enhanced heat sink are compared with that of bare copper surface heat sink using deionized (DI) water as the working fluid at Reynolds Number (Re) ranging from 106-636. The experimental results indicate an enhancement in Nusselt Number (Nu) at all Re with a maximum enhancement of 24% at Re = 106. An increase in pressure drop is also observed in all test cases due to enhanced roughness. The enhanced thermal performance is attributed to the enhanced wettability and the increased heat transfer surface area due to the addition of CuNWs arrays. The surface morphology of the heat sink has also been studied before and after heat transfer experiments through SEM to determine the effect of fluid flow on CuNWs arrays. The SEM results demonstrate no notable changes in surface morphology for the Re range in which experiments have been conducted and for single phase flow.

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Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging

Cited by 36 publications

References 27 publications

Aluminum bulk micromachining through an anodic oxide mask by electrochemical etching in an acetic acid/perchloric acid solution

Aluminum bulk micromachining through an anodic oxide mask by electrochemical etching in an acetic acid/perchloric acid solution

Pool Boiling Heat Transfer Enhancement Through Nanostructures on Silicon Microchannels

Thermohydraulic Characteristics of a Single-Phase Microchannel Heat Sink Coated With Copper Nanowires

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