2020
DOI: 10.1109/jstqe.2019.2950770
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Silicon Photonic Flex-LIONS for Bandwidth-Reconfigurable Optical Interconnects

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Cited by 25 publications
(5 citation statements)
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“…At the physical layer, an important aspect to consider is the scalability to large radix, which is mainly limited by crosstalk, loss, and the number of wavelengths. A promising approach is using a Thin-CLOS Flex-LIONS architecture as reported in [8]. All of the above aspects will be the objectives of our future studies.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…At the physical layer, an important aspect to consider is the scalability to large radix, which is mainly limited by crosstalk, loss, and the number of wavelengths. A promising approach is using a Thin-CLOS Flex-LIONS architecture as reported in [8]. All of the above aspects will be the objectives of our future studies.…”
Section: Discussionmentioning
confidence: 99%
“…The remainder of this paper is organized as follows: Section 2 introduces the working principle of Flex-LIONS with multiple FSRs. Section 3 discusses the fabrication of Flex-LIONS chips using a spatial switch based on a microring resonator (MRR) matrix (as in [8]) or a Beneš Mach-Zehnder switch (MZS) network [9]- [11]. Section 4 reports an experimental demonstration of the Multi-FSR Flex-LIONS principle using a fabricated 8-port SiPh integrated Copyright c 2020 The Institute of Electronics, Information and Communication Engineers chip.…”
Section: Introductionmentioning
confidence: 99%
“…In this regard, optical networks based on Wavelength Division Multiplexing (WDM) are seen as the main enabler for a seamless resource disaggregation. Some of the works have focused solely on the design and evaluation of flexible network fabrics to be exploited within CDC infrastructures (e.g., [6]) while others also focused on their integration with the hardware blades and the performance of the full system. As a result, several optical network designs have been proposed (e.g., [1,2]), with some works advocating for the use of hybrid networks combining electrical and optical switching technologies (e.g., [8]).…”
Section: Related Workmentioning
confidence: 99%
“…The other method is to construct a threedimensional (3D) network by achieving photonic integration layer by layer [15][16][17][18]. Besides crystalline silicon (c-Si) [19,20], amorphous silicon (a-Si) [15] and silicon nitride (SiN) [16,17,21] have been bonded or deposited and patterned on a siliconon-insulator (SOI) platform for dense integration. These 3D integration photonic devices are composed of either multiple passive layers [22] or multiple passive layers integrated with another active one [23], but none of them are all active layers.…”
Section: Introductionmentioning
confidence: 99%