2016
DOI: 10.1364/oe.24.006265
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Silicon photonic waveguide metrology using Mach-Zehnder interferometers

Abstract: We propose a procedure for characterizing fabrication deviations within a chip and among different chips in a wafer in silicon photonics technology. In particular, independent measurements of SOI thickness and waveguide width deviations can be mapped through the wafer, allowing a precise and non-destructive characterization of how these variations are distributed along the surface of the wafer. These deviations are critical for most wavelength-dependent integrated devices, like microring resonators, filters, e… Show more

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Cited by 18 publications
(12 citation statements)
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“…This is mostly caused by the unavoidable fluctuations of the silicon thickness due to foundry level non‐uniformities or variations in the waveguide width and slab thickness due to slightly different processing conditions. SOI wafers have typical silicon thickness variations of a few nanometers over the wafer, while waveguide width variations can be much larger. As an example, waveguide width variations as large as 15 nm over the wafer were measured in ref.…”
Section: Resultsmentioning
confidence: 99%
See 2 more Smart Citations
“…This is mostly caused by the unavoidable fluctuations of the silicon thickness due to foundry level non‐uniformities or variations in the waveguide width and slab thickness due to slightly different processing conditions. SOI wafers have typical silicon thickness variations of a few nanometers over the wafer, while waveguide width variations can be much larger. As an example, waveguide width variations as large as 15 nm over the wafer were measured in ref.…”
Section: Resultsmentioning
confidence: 99%
“…As an example, waveguide width variations as large as 15 nm over the wafer were measured in ref. [].…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…A schematic of the interleaving stage, before and after the optimization, is shown in the bottom panels of Figure 2. The MZI interleavers are very sensitive to the fabrication errors and need a dedicated trimming to allow the optical signal properly entering the cross-bar matrix [24]. In this case, the optical source (tunable laser) was injected at the interleaver input and was swept over the wavelength, within an interval of 200 GHz, i.e., one channel width.…”
Section: (Upper Panels)mentioning
confidence: 99%
“…While SOI wafers have typical silicon thickness variations of a few nm over the full wafer, on the other hand the waveguide width variations can be much larger. As an example, a variation of up to 15 nm in the waveguide width over the wafer is measured in [27]. Fabrication errors, once calibrated, can be compensated by varying the UV exposure within the wafer.…”
Section: System-level Analysismentioning
confidence: 99%