Silicon substrate ringing in microfabricated ultrasonic transducers

Ladabaum, I.; Wagner, P.; Zanelli, Claudio I.; Mould, John; Reynolds, Paul; Wojcik, G.

doi:10.1109/ultsym.2000.922696

Cited by 38 publications

(30 citation statements)

References 9 publications

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“…The ripple in the response is expected in both cases, and corresponds to the distance from the reflector and the speed of sound in the rapeseed oil. The property of interest in these plots is a dip in the magnitude of the ripple, as the one seen at about 10MHz, and less notable at about 20MHz in Fig 3. These are believed to be appearing due to ringing, as similar behavior was reported in [10] and [11]. In the response with the backing layer added these dips are much less prominent, which indicates that the layer dampens the ringing.…”

Section: Performance Of Backing Layersupporting

confidence: 68%

“…The purpose of the backing layer is to reduce the ringing effect in the CMUT. This has been reported to be effective in [10], and comparison with measurements from before the layer was added will show how it performs in this case. The initial frequency responses for the CMUT, without and with the backing layer added, are shown in Fig 3 and Fig 4 respectively.…”

Section: Performance Of Backing Layermentioning

confidence: 93%

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Internal ringing effect in capacitive micromachined Ultrasonic Transducer

Salim

Malek

Heng

et al. 2011

2011 IEEE Symposium on Industrial Electronics and Applications

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The effect of internally resonance at silicon substrate in capacitive micromachined Ultrasonic Transducer presented using Experimental and theoretical calculation. This ringing is clearly observed in immersion transducers with 4.2 MHz. A mathematical analytical model of the attenuation yield by ringing effective and simulation has been introduced. Experimental results are further compared to simulations carried out in timedomain and qualitative agreement is evidence. The insights gained from the simulations and experiments will be use to improve the analytic echoscope. The capacitive micromachined Ultrasonic Transducer whose ringing mode is successfully eliminated with backing layer.

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Section: Performance Of Backing Layersupporting

confidence: 68%

Section: Performance Of Backing Layermentioning

confidence: 93%

Internal ringing effect in capacitive micromachined Ultrasonic Transducer

Salim

Malek

Heng

et al. 2011

2011 IEEE Symposium on Industrial Electronics and Applications

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“…The waveform also contains an oscillation, which, from the spectrum, has a center frequency of approximately 8 MHz, corresponding to a thickness resonance of the 0.5-mm thick silicon substrate upon which the device was micromachined. This resonance has been noticed in other similar devices and is a contributing factor in the cross-coupling between elements in array structures [25], [26]. Also note that the hydrophone output waveform is bipolar in nature, whereas that from the micromachined device is monopolar.…”

Section: Experiments In Liquidssupporting

confidence: 61%

Novel, wide bandwidth, micromachined ultrasonic transducers

Noble

Jones

Robertson

et al. 2001

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

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Surface micromachined, capacitive ultrasonic transducers have been fabricated using a low thermal budget, CMOS-compatible process. This process allows inherent control of parameters such as membrane size and thickness, cavity size and the intrinsic stress in the membrane to be achieved. Devices fabricated using this process exhibit interesting properties for transduction in air at frequencies in excess of 1 MHz when driven from a standard ultrasonic voltage source. Experiments have been performed with devices containing silicon nitride membranes of variable thicknesses over a 2 m thick air cavity and with device dimensions of up to 5 mm square. This is much larger than has been reported for a device with a single membrane. Calibration measurements using 1/8 inch microphones in air, and miniature PVDF hyrdophones in water, have been performed. The dependence on d.c. bias voltage is examined, involving static membrane deflection measurements and received peak voltages. Pulse-echo and pitch-catch mode operation have been achieved. Interferometric measurements of membrane displacement have been performed in air to illustrate the membrane deflection characteristics. Operation in liquids is also discussed.

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“…At these frequencies, the plate resonates with infinite phase velocity and zero group velocity. Ladabaum et al observed significant substrate ringing at the frequencies corresponding to longitudinal-wave resonances along the thickness of the substrate, and demonstrated that these resonances could be moved out of the transducer frequency spectrum by thinning the substrate [12].…”

Section: Dispersion Relationsmentioning

confidence: 99%

Acoustical cross-talk in row–column addressed 2-D transducer arrays for ultrasound imaging

2015

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The acoustical cross-talk in row-column addressed 2-D transducer arrays for volumetric ultrasound imaging is investigated. Experimental results from a 2.7 MHz, λ/2-pitch capacitive micromachined ultrasonic transducer (CMUT) array with 62 rows and 62 columns are presented and analyzed in the frequency-wavenumber domain. The sources of cross-talk are identified and predicted theoretically. The nearest neighbor cross-talk is -23.9±3.7 dB when the array is used as a 1-D array with the rows functioning as both transmitters and receivers. In the row-column configuration, with the columns transmitting and the rows receiving, the cross-talk is reduced to -40.2±3.5 dB.

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Silicon substrate ringing in microfabricated ultrasonic transducers

Cited by 38 publications

References 9 publications

Internal ringing effect in capacitive micromachined Ultrasonic Transducer

Internal ringing effect in capacitive micromachined Ultrasonic Transducer

Novel, wide bandwidth, micromachined ultrasonic transducers

Acoustical cross-talk in row–column addressed 2-D transducer arrays for ultrasound imaging

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