2018 IEEE International Interconnect Technology Conference (IITC) 2018
DOI: 10.1109/iitc.2018.8430443
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Silicon Trench Etch Uniformity Improvement for Microloading and Macro-to-Macro Loading for sub-14nmNode

Yanfei Yang
1
,
Sangwoo Lim
2
,
Junsic Hong
3
et al.
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