Silk‐Based Conformal, Adhesive, Edible Food Sensors

Tao, Hu; Brenckle, Mark A.; Yang, Miaomiao; Zhang, Jingdi; Liu, Mengkun; Siebert, Sean; Averitt, R. D.; Mannoor, Manu Sebastian; McAlpine, Michael C.; Rogers, John A.; Kaplan, David L.; Omenetto, Fiorenzo G.

doi:10.1002/adma.201103814

Cited by 359 publications

(277 citation statements)

References 31 publications

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“…Éstas se pueden aplicar en diversos campos, como: biomedicina [44], farmacología, óptica [8], industria cosmética [45], empaques [9] y muchos más. En cuanto a las aplicaciones relacionadas con empaques de alimentos, sobresalen el desarrollo de sensores con nanoestructuras metálicas y FS para determinar la calidad del alimento [46]; el desarrollo de empaques con inclusión de FS como componente funcional [30]; la evaluación del efecto antimicrobiano de películas comestibles de FS carragenina y extracto de semillas de uva [47]; entre otros.…”

Section: Aplicaciones De La Fsunclassified

“…Las NM se ubican en la superficie de los alimentos y son sensibles a los cambios dieléctricos que tengan los mismos (propiedad relacionada con la composición del material y la densidad del alimento), permitiendo evaluar y controlar la evolución de éstas propiedades físico-químicas en el tiempo. Este proceso permite que el contacto entre las nanoestructuras del sensor y el alimento, proporcione un seguimiento in situ de la calidad de los alimentos que se desean consumir [46].…”

Section: Empaques Inteligentes Sensoresunclassified

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Revisión: Fibroína de seda y sus potenciales aplicaciones en empaques biodegradables para alimentos/Review: silk fibroin and their potential applications on biodegradable food packaging

et al. 2017

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RESUMENEl cuidado del medioambiente y el uso responsable de los recursos, ha promovido investigaciones con diferentes biopolímeros que permitan el desarrollo de nuevos materiales que puedan ser empleados en empaques para alimentos. Entre estos biopolímeros se encuentra la fibroína de seda (FS), que representa cerca del 70% de la fibra de seda y puede ser obtenida a partir de capullos de primera calidad o de los desperdicios generados en la producción serícola. En el desarrollo de empaques de alimentos con FS, se pueden dar dos alternativas de producción, una en la que la FS puede ser funcionalizada por otros componentes, y otra en la que se incluye la FS como componente funcional modificando otros biopolímeros. La FS puede conferirle al material de empaque ciertas propiedades, como: aumento de la permeabilidad de oxígeno, resistencia a la rotura y una mayor velocidad de degradación del biopolímero. Este artículo se centra en cuatro temas principales: empaques, biopolímeros en empaques, FS y finalmente, la FS en empaques para alimentos.Palabras clave: Empaques, Materiales poliméricos, Biopolímeros, Fibroína de seda, Biomateriales. ABSTRACTEnvironmental protection and responsible use of resources, have promoted research of different biopolymers allowing to develop biodegradable materials which can be used in food packaging. Among these biopolymers is silk fibroin (SF), this protein represents nearly 70% of the silk fiber and it can be obtained from high quality cocoons or from waste generated in the silk industry. In the development of food packaging with SF, there are two possible alternative of production, one in what the SF can be functionalized by other components and another in which, the FS is included as functional component modifying other biopolymers. In the case of food packaging, the SF can concede desirable properties to the package such as an increase in oxygen permeability, more tensile strength and a higher biopolymer degradation rate. This paper is focused on four main topics: packaging, biopolymers in packaging, SF and finally, the SF in food packaging.

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Section: Aplicaciones De La Fsunclassified

Section: Empaques Inteligentes Sensoresunclassified

Revisión: Fibroína de seda y sus potenciales aplicaciones en empaques biodegradables para alimentos/Review: silk fibroin and their potential applications on biodegradable food packaging

et al. 2017

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“…These technologies will provide a risk assessment of life style and age related diseases and thus offer a personalized and constantly updated diagnosis. Among the examples recently proposed in literature the biodegradable (sometime also called transient) electronics [206,207] and the silk [208,209] based photonics are the most promising ones. The former topic suggests the possibility to use organics to fabricate optoelectronics circuits that can be implanted (or edible) and that perform their action of monitoring or drug releasing for a controlled period of time within the host body.…”

Section: Conclusion and Future Perspectivesmentioning

confidence: 99%

Hybrid Materials for Integrated Photonics

Bettotti

2014

Advances in Optics

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In this review materials and technologies of the hybrid approach to integrated photonics (IP) are addressed. IP is nowadays a mature technology and is the most promising candidate to overcome the main limitations that electronics is facing due to the extreme level of integration it has achieved. IP will be based on silicon photonics in order to exploit the CMOS compatibility and the large infrastructures already available for the fabrication of devices. But silicon has severe limits especially concerning the development of active photonics: its low efficiency in photons emission and the limited capability to be used as modulator require finding suitable materials able to fulfill these fundamental tasks. Furthermore there is the need to define standardized processes to render these materials compatible with the CMOS process and to fully exploit their capabilities. This review describes the most promising materials and technological approaches that are either currently implemented or may be used in the coming future to develop next generations of hybrid IP devices.

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“…The primary approaches include using thin silicon islands [12] with flexible interconnects [13], organic polymers [14], and Single Wall Carbon Nanotubes (SWNT) [15]. These devices can be implemented on a variety of flexible and stretchable substrates including polyimide, paper [16], silk [17], and silicone [18]. Already there are examples of medium scale integration of these devices into useful circuits [19], including work on a Carbon Nanotube ADC [20].…”

Section: B Flexible Electronicsmentioning

confidence: 99%