Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

Li, C. C.; Drymiotis, Fivos; Liao, Li-Ling; Dai, Ming-Ji; Liu, C. K.; Chen, C. L.; Chen, Y. Y.; Kao, C. R.; Snyder, G. Jeffrey

doi:10.1016/j.enconman.2015.03.089

Cited by 28 publications

(12 citation statements)

References 23 publications

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“…Coefficient of thermal expansion (CTE) was considered to investigate whether the CPI used as the substrate could affect the resistance value of the electrodes. The CTEs of Ag and CPI are 18.9 × 10 –6 and 46.79 × 10 –6 K –1 , respectively. , It is about 100 times lower than the TCR value of Ag NWs, which is considered to have a minor influence on the resistance change of the sensor. Therefore, it is reasonable to insist that the thermoelectric behavior is originated from the resistance changes of Ag NWs.…”

Section: Resultsmentioning

confidence: 92%

“…The CTEs of Ag and CPI are 18.9 × 10 −6 and 46.79 × 10 −6 K −1 , respectively. 37,38 It is about 100 times lower than the TCR value of Ag NWs, which is considered to have a minor influence on the resistance change of the sensor. Therefore, it is reasonable to insist that the thermoelectric behavior is originated from the resistance changes of Ag NWs.…”

Section: Resultsmentioning

confidence: 99%

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Wireless Real-Time Temperature Monitoring of Blood Packages: Silver Nanowire-Embedded Flexible Temperature Sensors

Youn

Jung

Naqi

et al. 2018

ACS Appl. Mater. Interfaces

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Real-time temperature monitoring of individual blood packages capable of wireless data transmission to ensure the safety of blood samples and minimize wastes has become a critical issue in recent years. In this work, we propose flexible temperature sensors using silver nanowires (NWs) and a flexible colorless polyimide (CPI) film integrated with a wireless data transmission circuit. The unique design of the temperature sensors was achieved by patterning Ag NWs using a three-dimensional printed mold and embedding the patterned Ag NWs in the CPI film (p-Ag NWs/CPI), which resulted in a flexible temperature sensor with electrical, mechanical, and temperature stability for applications in blood temperature monitoring. Indeed, a reliable resistance change of the p-Ag NWs/CPI was observed in the temperature range of −20 to 20 °C with a robust bending stability of up to 5000 cycles at 5 mm bending radius. Real-time and wireless temperature monitoring using the p-Ag NWs/CPI was demonstrated with the packages of rat blood. The result revealed that the stable and consistent temperature monitoring of individual blood packages could be achieved in a blood box, which was mainly attributed to the conformal attachment of the p-Ag NWs/CPI to different packages in a blood container.

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Section: Resultsmentioning

confidence: 92%

Section: Resultsmentioning

confidence: 99%

Wireless Real-Time Temperature Monitoring of Blood Packages: Silver Nanowire-Embedded Flexible Temperature Sensors

Youn

Jung

Naqi

et al. 2018

ACS Appl. Mater. Interfaces

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“…Ag is a commonly used element in the field of electronic devices, the Ag/PbTe/Ag structure was prepared by using a rapid hot press . A nearly perfect Ag/PbTe interface was observed after bonding.…”

Section: State-of-the-art Te Materials In Contact Designmentioning

confidence: 99%

Research Progress of Interfacial Design between Thermoelectric Materials and Electrode Materials

Yang

Sheng

et al. 2023

ACS Appl. Mater. Interfaces

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Intensive efforts have been conducted to realize the reliable interfacial joining of thermoelectric materials and electrode materials with low interfacial contact resistance, which is an essential step to make thermoelectric materials into thermoelectric devices for industrial application. In this review, the roles of structural integrity, interdiffusion, and contact resistance in long-term reliabilities of thermoelectric modules are outlined first. Then interfacial reactions of near-room-temperature Bi2Te3-based thermoelectric materials and various electrode materials are reviewed comprehensively. We also summarized the joining behavior of the mid-temperature PbTe-based thermoelectric materials and commonly used electrode materials. Subsequently, for other thermoelectric materials systems, i.e., SiGe, CoSb3, and Mg3Sb2, previous attempts to join with some electrode materials are also recapitulated. Finally, some future prospects to further improve the joint reliability in thermoelectric device manufacturing are proposed. We believe that this review will provide guidance for preparing thermoelectric devices and optimizing thermoelectric device design.

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“…As bonding (400°C), both Ag and Cu atoms diffuse into PbTe, and form Ag 2 Te and Cu 2 Te IMC, respectively [49,50]. An increase in bonding temperature ( ∼ 550°C) leads to the formation of liquid Pb that induces voids and cracks.…”

Section: Bonding In Pbte-based Modulesmentioning

confidence: 99%

Interfacial reactions in thermoelectric modules

Wei

et al. 2018

Materials Research Letters

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Engineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi 2 Te 3 -based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For midtemperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well. ARTICLE HISTORY

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Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

Cited by 28 publications

References 23 publications

Wireless Real-Time Temperature Monitoring of Blood Packages: Silver Nanowire-Embedded Flexible Temperature Sensors

Wireless Real-Time Temperature Monitoring of Blood Packages: Silver Nanowire-Embedded Flexible Temperature Sensors

Research Progress of Interfacial Design between Thermoelectric Materials and Electrode Materials

Interfacial reactions in thermoelectric modules

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