Silver Meshes for Record-Performance Transparent Electromagnetic Interference Shielding

Abstract

We present a simulation and experimental study of silver meshes to determine their performance for transparent electromagnetic interference (EMI) shielding. Simulations were employed to study the effects of the silver mesh’s width, pitch, and thickness on EMI shielding efficiency (SE) in the 8–18 GHz frequency range and transparency in the visible spectrum. We demonstrate a scalable, facile fabrication method that involves embedding meshes in glass by etching trenches in glass and filling and curing reactive particle-free silver ink in these trenches. Our silver meshes achieve 58.4 dB EMI SE with 83% visible light transmission and 48.3 dB EMI SE with 90.3% visible transmission. The combination of high-conductivity silver, small widths (1.3 to 5 μm), and large thicknesses (0.5 to 2.0 μm) enables the best performance of metal meshes as well as single-sided shielding materials for transparent EMI shielding, as reported in the literature.

Flexible Embedded Metal Meshes by Sputter-Free Crack Lithography for Transparent Electrodes and Electromagnetic Interference Shielding

“…We transferred the self-forming cracks to the PET using RIE with a gas flow of 50 sccm CF 4 and 20 sccm SF 6 , a pressure of 30 mT, and a power of 250 W. RIE is well-suited for etching high-aspect-ratio anisotropic structures, such as deep trenches or narrow channels. This capability is essential for creating complex patterns with varying depths. , RIE provides control over the etch rate, resulting in varying trench thicknesses. , However, it is important to note that the crack template layer is also susceptible to etching. This imposes a limitation on the maximum etching time and, consequently, the achievable depth of the trenches.…”

“…In contrast, metal meshes tend to maintain consistent uniform properties without percolation or contact issues. Several well-established methodologies have been developed for the fabrication of metal meshes, including photolithography, ,− imprint lithography, − 3D printing, , crack lithography, ,− electrodeposition, , e-beam direct writing, and self-assembly . Most of these methods, however, are costly, time-intensive, and often unsuitable for large-scale production.…”

Highly Transparent Ka-/W-Band Electromagnetic Shielding Films Based on Double-Layered Metal Meshes

“…In AgNW electrodes, the trade-off for increasing the electrical conductivity decreases the optical transmittance because they are uniformly coated over the entire area of the substrate. − However, transparent electrodes with a metal-mesh structure may increase the electrical conductivity without reducing the optical transmittance by increasing the height of the electrode pattern while maintaining the line width and aperture size. Therefore, active research is underway on EM-shielding films with mesh-type transparent electrodes. − Mesh-structured transparent electrodes can be broadly classified into a micromesh electrode (MME) or a nanomesh electrode (NME). The MME used in an EM-shielding film is mainly fabricated using methods such as electroplating, wet etching, and printing process. − They are fabricated such that they have a line width in the range of 2–10 μm.…”

Carbonized Syndiotactic Polystyrene/Carbon Nanotube/MXene Hybrid Aerogels with Egg-Box Structure: A Platform for Electromagnetic Interference Shielding and Solar Thermal Energy Management

“…Electromagnetic interference (EMI) shielding materials, including carbon aerogels, , metallic materials, composite foams, , polymeric composites, − and cementitious composites, are booming. These materials possess high electrical conductivity, which plays a critical role to achieve high EMI shielding effectiveness (SE). − Moreover, the topological structure can significantly affect the materials’ EMI SE, for example, the gradient and/or sandwich structures were demonstrated to enhance the effectiveness by facilitating multiple reflections between parallel reflective planes. ,,, …”