Silver pick-up during tail formation and its effect on free air ball in thermosonic copper ball bonding

Lee, J.; Mayer, Michael; Zhou, Y.; Hong, S. J.; Moon, J.T.

doi:10.1109/ectc.2008.4550262

Cited by 3 publications

(1 citation statement)

References 17 publications

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“…Therefore, fine and ultra‐fine pitch bonding using copper wire has recently gained popularity because of its many advantages (Hong et al , 2005; Tian et al , 2005; Chen, H., et al , 2006; Ratchev et al , 2006; England and Jiang, 2007; Xu et al , 2008), despite the additional cost of forming gas during copper wire bonding (Goh and Zhong, 2007a). However, this also brings new challenges (Degryse et al , 2005; Kaimori et al , 2006a, b; Zhang et al , 2006; Murali et al , 2007; Zhang et al , 2007; Hang et al , 2008; Lee et al , 2008; Tian et al , 2008). Higher parameter settings may have to be used to improve stitch bondability, causing heavy cap marks and potential short tails or wire open.…”

Section: Challenges In Fine and Ultra‐fine Pitch Wire Bondingmentioning

confidence: 99%

Fine and ultra‐fine pitch wire bonding: challenges and solutions

Zhong

2009

Microelectronics International

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PurposeThe purpose of this paper is to review recent advances in fine and ultra‐fine pitch wire bonding.Design/methodology/approachDozens of journal and conference articles published recently are reviewed.FindingsThe problems/challenges such as possible wire sweep and decreased bonding strength due to small wire sizes, non‐sticking, metal pad peeling, narrow process windows, wire open and short tail defects are analysed. The solutions to the problems and recent findings/developments in fine and ultra‐fine pitch wire bonding are discussed.Research limitations/implicationsBecause of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.Originality/valueThis paper attempts to provide an introduction to recent developments and the trends in fine and ultra‐fine pitch wire bonding. With the references provided, readers may explore more deeply by reading the original articles.

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