2022
DOI: 10.1049/pel2.12252
|View full text |Cite
|
Sign up to set email alerts
|

Simple analytical model for accurate switching loss calculation in power MOSFETs using non‐linearities of Miller capacitance

Abstract: A simple and accurate analytical model for the estimation of switching losses on power MOSFETs is proposed. It consists of simplifying the non‐linear behaviour of Miller capacitance as a function of voltage. Experimental results are used to validate the model in the 5–500 kHz range. The proposed analytical model is compared to other frequently used methods. Results confirm the accuracy of the proposed model in different voltage levels, using four different MOSFET part numbers, spanning three technologies: SiC,… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

0
7
0
1

Year Published

2022
2022
2024
2024

Publication Types

Select...
6
1
1

Relationship

1
7

Authors

Journals

citations
Cited by 24 publications
(8 citation statements)
references
References 27 publications
(134 reference statements)
0
7
0
1
Order By: Relevance
“…To calculate the losses in high-side and low-side switches (P E2 and P E3 ), the models presented in [36], [37] are used. First, the conduction, switching, and reverse recovery losses are calculated for the ambient temperature.…”
Section: A Thermal Model -Layoutmentioning
confidence: 99%
See 1 more Smart Citation
“…To calculate the losses in high-side and low-side switches (P E2 and P E3 ), the models presented in [36], [37] are used. First, the conduction, switching, and reverse recovery losses are calculated for the ambient temperature.…”
Section: A Thermal Model -Layoutmentioning
confidence: 99%
“…To enhance the accuracy of thermal measurements, the use of a heat sink and forced ventilation are not used. This decision is made considering that the thermal resistance of a heat sink is nonlinear concerning factors such as length, number of fins, air flux, and altitude, among others [21], [36], [38], [39]. The test bench and the support box for the prototypes under test are depicted in Figure 9.…”
Section: A Thermal Model -Layoutmentioning
confidence: 99%
“…As perdas nos semicondutores podem ser estimadas, em geral, de três formas: modelos analíticos, SPICE ou análise de elementos finitos. Dentre estes, os modelos analíticos possuem a menor complexidade e maior velocidade de processamento, além de razoável acurácia [39]- [41]. Os modelos de perdas de condução e comutação apresentados em [42] são utilizados neste trabalho, e o part number FS75R07N2E4 [43] de módulo de IGBTs foi escolhido.…”
Section: Conversor: Semicondutores E Sistema De Transferência De Calorunclassified
“…For the calculation of conduction ( ), switching ( ) and reverse recovery ( ) losses, the models presented in [ 36 , 37 ] are used. The conduction losses are evaluated as a function of the junction temperature.…”
Section: Experimental Validation Of Computational and Thermal Modelsmentioning
confidence: 99%
“…As mentioned in [ 36 , 37 , 38 , 39 , 40 ], the of the MOSFET is a function of . Thus, it is necessary to obtain thermal models that represent the temperature variation over time.…”
Section: Experimental Validation Of Computational and Thermal Modelsmentioning
confidence: 99%