Simplified modelling of printed circuit boards for spacecraft applications

Amy, Robin Alastair; Aglietti, Guglielmo S.; Richardson, Guy

doi:10.1016/j.actaastro.2009.01.037

Cited by 12 publications

(5 citation statements)

References 8 publications

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“…The mechanical properties are estimated from the PCB laminate tests and then the same have been incorporated in the model. It is known that the density and stiffness of PCB will be higher when the electronic components are mounted in comparison with bare PCB [1,2] and it can be clearly seen from the test results shown in Table 1. The density and stiffness have been locally increased wherever the high density components are mounted.…”

Section: Inputs 31 Dynamic Analysismentioning

confidence: 94%

Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite

Veeramuthuvel

Jayaraman

Shankar³

et al. 2014

AMM

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The electronics package in a spacecraft is subjected to a variety of dynamic loads during launch phase and suitable thermal environment for the mission life. The dynamic and thermal analyses performed for a structurally reconfigured electronics package. Two different simulation models are developed to carry out the analyses. This paper discusses in two parts, in part-1, the vibration responses are determined at various critical locations, including on the Printed Circuit Board (PCB) for the vibration loads specified by launch vehicle using Finite Element Analysis (FEA). The mechanical properties of PCB are determined from the test specimens, which are then incorporated in the finite element model. In part-2, the steady-state temperature distributions on the components and on the PCB are determined, to check the effectiveness of heat transfer path from the components to the base of the package and to verify the predicted values are within the acceptable temperature limits specified. The predicted temperature values are then compared with on-orbit observations.

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Section: Inputs 31 Dynamic Analysismentioning

confidence: 94%

Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite

Veeramuthuvel

Jayaraman

Shankar³

et al. 2014

AMM

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“…During this period, R.A.Amy [4,5] considered the modeling simplification of the PCB assembly and the problem of accuracy, and gives a strong focus on the error resulting from simplification and input variables. First, a random simplification model is selected as a benchmark; then different degrees of simplification are obtained by changing the input parameters; finally calculate different simplification combinations to get the deformation (curvature) error of the board assembly.…”

Section: Current State Of the Artmentioning

confidence: 99%

Correlation Factor Analysis of FEA Model Simplification Methods of Printed Circuit Board

Fei

et al. 2011

2011 Seventh International Conference on Computational Intelligence and Security

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Aiming at the failures of aviation electronic equipments which experienced vibration load, the simulation on vibration characteristic of the printed circuit board is presented using the finite element analysis software ANSYSWorkbench. Various input factors that may have correlation with the modal frequencies and mode shapes of the PCB are studied by the illustration of an avionics printed circuit board. The contrast study mainly focus on the PCB material parameters, meshing conditions, different model reduction methods and means of contact constraints. The principles of simplifying FEA model are acquired through the sensitivity analysis of various factors on the frequency error. The experience on of electronic products is accumulated, and the accuracy of failure prediction is ensured by using the results of vibration response.

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“…The extremely harsh random vibrations occur during the multiple stage operations of rocket right after the ignition for takeoff, typically three to five minutes of the powerful thrust to escape the earth gravity [7]. After the satellite arrives at the target orbit, the system is then exposed to thermal cycles while rotating around the earth.…”

Section: Introductionmentioning

confidence: 99%

PBGA packaging reliability assessments under random vibrations for space applications

Kim

Hwang

2015

Microelectronics Reliability

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Simplified modelling of printed circuit boards for spacecraft applications

Cited by 12 publications

References 8 publications

Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite

Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite

Correlation Factor Analysis of FEA Model Simplification Methods of Printed Circuit Board

PBGA packaging reliability assessments under random vibrations for space applications

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