Simplified server model to simulate data center cooling energy consumption

Ham, Sang-Woo; Kim, Min‐Hwi; Choi, Byung-Nam; Jeong, Jae-Weon

doi:10.1016/j.enbuild.2014.10.058

Cited by 72 publications

(31 citation statements)

References 25 publications

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“…Considering the IT equipment in server chassis has homogeneous physical states, we adopt a thermal resistance model to characterize the steady heat transfer between IT equipment and cooling air [24], which is expressed as…”

Section: Heat Recirculation Modelmentioning

confidence: 99%

Comparative Study of Energy Performance between Chip and Inlet Temperature-Aware Workload Allocation in Air-Cooled Data Center

Yan

2018

Energies

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Improving the energy efficiency of data center has become a research focus in recent years. Previous works commonly adopted the inlet temperature constraint to optimize the thermal environment in the data center. However, the inlet temperature-aware method cannot prevent the servers from over-cooling. To cope with this issue, we propose a thermal-aware workload allocation strategy with respect to the chip temperature constraint. In this paper, we conducted a comparative evaluation of the performance between the chip and inlet temperature-aware workload allocation strategies. The workload allocation strategies adopt a POD-based heat recirculation model to characterize the thermal environment in data center. The contribution of the temperature-dependent leakage power to server power consumption is also considered. We adopted a sample data center under constant-flow and variable-flow cooling air supply to evaluate the performance of these two different workload allocation strategies. The comparison results show that the chip temperature-aware workload allocation strategy prevents the servers from over-cooling and significantly improves the energy efficiency of data center, especially for the case of variable-flow cooling air supply.

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Section: Heat Recirculation Modelmentioning

confidence: 99%

Comparative Study of Energy Performance between Chip and Inlet Temperature-Aware Workload Allocation in Air-Cooled Data Center

Yan

2018

Energies

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“…The power consumption of servers varies depending on a variety of factors such as applications, server architectures, and so on [11], [12]. To keep generality of discussion, we use a simple server model in this paper.…”

Section: Server Modelmentioning

confidence: 99%

Tandem Equipment Arranged Architecture with Exhaust Heat Reuse System for Software-Defined Data Center Infrastructure

Taniguchi

Suganuma

Deguchi

et al. 2017

IEEE Trans. Cloud Comput.

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In this paper, we propose a novel energy-efficient architecture for software-defined data center infrastructures. In our proposed data center architecture, we include an exhaust heat reuse system that utilizes high-temperature exhaust heat from servers in conditioning humidity and air temperature of office space near the data center. To obtain high-temperature exhaust heat, equipment such as server racks and air conditioners are deployed in tandem so that the aisles are divided into three types: cold, hot, and super-hot. In this paper, to investigate the fundamental characteristics of our proposed data center architecture, we consider various types of data center models and conduct numerical simulations that use results obtained by experiments at an actual data center. Through simulation, we show that the total power consumption by a data center with our proposed architecture is 27% lower than that by data center with a conventional architecture. In addition, it is also shown that the proposed tandem equipment arrangement is suitable for obtaining high-temperature exhaust heat and decreasing the total power consumption significantly under a wider range of conditions than in the conventional equipment arrangement.

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“…For simplicity, the computing workload is assigned among the servers in the same chassis uniformly. To keep the server running in a reliable thermal state, the chip temperature needs to be maintained below the critical threshold (e.g., 75 to 90 • C [30,33]). In this study, we adopt T chip = 80 • C as the upper threshold of the chip temperature.…”

Section: Problem Statement and Ga Optimizationmentioning

confidence: 99%

Chip Temperature-Based Workload Allocation for Holistic Power Minimization in Air-Cooled Data Center

Yan

2017

Energies

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Minimizing the energy consumption is a dominant problem in data center design and operation. To cope with this issue, the common approach is to optimize the data center layout and the workload distribution among servers. Previous works have mainly adopted the temperature at the server inlet as the optimization constraint. However, the inlet temperature does not properly characterize the server's thermal state. In this paper, a chip temperature-based workload allocation strategy (CTWA-MTP) is proposed to reduce the holistic power consumption in data centers. Our method adopts an abstract heat-flow model to describe the thermal environment in data centers and uses a thermal resistance model to describe the convective heat transfer of the server. The core optimizes the workload allocation with respect to the chip temperature threshold. In addition, the temperature-dependent leakage power of the server has been considered in our model. The proposed method is described as a constrained nonlinear optimization problem to find the optimal solution by a genetic algorithm (GA). We applied the method to a sample data center constructed with computational fluid dynamics (CFD) software. By comparing the simulation results with other different workload allocation strategies, the proposed method prevents the servers from overcooling and achieves a substantial energy saving by optimizing the workload allocation in an air-cooled data center.

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Simplified server model to simulate data center cooling energy consumption

Cited by 72 publications

References 25 publications

Comparative Study of Energy Performance between Chip and Inlet Temperature-Aware Workload Allocation in Air-Cooled Data Center

Comparative Study of Energy Performance between Chip and Inlet Temperature-Aware Workload Allocation in Air-Cooled Data Center

Tandem Equipment Arranged Architecture with Exhaust Heat Reuse System for Software-Defined Data Center Infrastructure

Chip Temperature-Based Workload Allocation for Holistic Power Minimization in Air-Cooled Data Center

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