Simulating moisture diffusion in polymers using thermal-moisture analogy

Arun, S; Gromala, Przemyslaw Jakub

doi:10.1109/eurosime.2016.7463372

Cited by 4 publications

(5 citation statements)

References 6 publications

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“…A greater diffusion was observed in the films containing tocopherol and MMT15A. Water diffusion in polymers is a process of moisture condensation in micro or nanopores, free volumes, and interface of polymeric material (Sasi & Gromala, 2016). A decrease in TS and EM was observed in these films due to the plasticizing effect of tocopherol, which increased the free space in the polymeric matrix, favoring the water diffusion.…”

Section: Resultsmentioning

confidence: 99%

Chitosan‐nanocomposites as a food active packaging: Effect of addition of tocopherol and modified montmorillonite

Dias

Azevedo

Ferreira

et al. 2021

J Food Process Engineering

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The development of natural biodegradable polymers to partially or totally replace synthetic polymers may be advantageous in food packaging, mainly when are associated with additional features such as active packaging. This article aimed to evaluate the effect of tocopherol concentration (0, 5, 10, and 20%) and modified montmorillonite clay (MMT15A) nanoparticles (0 and 1%) on the properties of chitosan (CS) films. The addition of tocopherol provided antioxidant activity and improved the thermal stability of the films, and acted as a plasticizer, decreasing the tensile strength, elastic modulus, and glass transition temperature of the films. Although MMT15A and tocopherol did not change the water vapor permeability, an improvement of the mechanical strength and lower equilibrium moisture content was observed when compared to the treatment made with CS alone. Both MMT15A and tocopherol allowed the production of bio‐nanocomposites with thermal, morphological, mechanical, and water‐resistant properties to be used as an antioxidant in packaging materials. Practical Applications The films containing both montmorillonite (MMT15A) and tocopherol presented an improved mechanical strength, thermal stability, and antioxidant activity when compared to the films containing the only tocopherol. Therefore, it was possible to develop antioxidant chitosan films with improved properties using up to 20% tocopherol and MMT15A. At this tocopherol and MMT 15A concentrations, the films may also be used to nutritionally enrich food, adding value to the package and the conditioned product. Furthermore, the films can also be considered edible films with combined properties.

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Section: Resultsmentioning

confidence: 99%

Chitosan‐nanocomposites as a food active packaging: Effect of addition of tocopherol and modified montmorillonite

Dias

Azevedo

Ferreira

et al. 2021

J Food Process Engineering

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show abstract

“…o Moisture diffusion and formation of hygroscopic stress field in the coating sample were determined, using the coupled moisture-displacement problem solution, obtained using the thermal-moisture direct analogy in ABAQUS/Standard [14], [15]. Saturation weight gain by the coating at 90% relative humidity and 60°C was approximately 2.5% of the initial weight.…”

Section: Humidity Effect and Coating Debondingmentioning

confidence: 99%

Complex damage mechanisms and roughness evolution of wind turbine blade surface: Multiphysics and stochastic effect modelling

Mishnaevsky,

Kuthe,

Tempelis

et al. 2023

IOP Conf. Ser.: Mater. Sci. Eng.

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Leading edge erosion of wind turbine blades is the most often observed damage mechanism of wind turbines. The surface erosion of blades is influenced by many multiphysics and stochastic factors including humidity and related degradation processes, rough uneven surface and roughness development, random defects in the materials. In this paper, the effects of these factors and possibilities of their computational modelling and prediction are discussed. Competing damage mechanisms in erosion, including debonding and impact damage, as well moisture ingress and weathering are investigated. A predictive model for roughness evolution of leading edge due to the surface damage is presented.

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“…Due to polymers' inherent porous and hygroscopic characteristics, plastic packaged devices absorb moisture during storage and use [12][13][14]. Under normal temperature and low humidity environment [15], in the early stage of moisture diffusion [16], when the internal relative humidity (RH) is low [17], or when the moisture diffusity is much lower than the stress relaxation of polymers [18], the moisture diffusion in polymers also follows the Fickian's law like heat conduction. In a high temperature and high humidity environment [15], in the later stage of moisture diffusion [16], when the internal RH is close to the saturated humidity [17], or when the moisture diffusity exceeds the stress relaxation of polymers [18], the moisture diffusion in polymers exhibits non-Fickian's law behaviors.…”

Section: Influence Of Thermal and Moisture On Plastic Packaged Devicesmentioning

confidence: 99%

“…In a high temperature and high humidity environment [15], in the later stage of moisture diffusion [16], when the internal RH is close to the saturated humidity [17], or when the moisture diffusity exceeds the stress relaxation of polymers [18], the moisture diffusion in polymers exhibits non-Fickian's law behaviors. When the RH in polymers is high, the moisture diffusion coefficient gradually decreases [19] and becomes a function of concentration [17]. In this case, using Fickian's law for fitting and simulation overestimates the moisture concentration in the polymers.…”

Section: Influence Of Thermal and Moisture On Plastic Packaged Devicesmentioning

confidence: 99%

Research on the relationship between time-dependent strains and delamination of plastic packaged devices at polymer/copper interface under thermal-hygro environments

Shi¹,

Qiu²,

Zhang³

et al. 2022

Modelling Simul. Mater. Sci. Eng.

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Delamination of polymer/metal interfaces has a destructive effect on plastic packaged devices containing thin layered structures. The physics mechanisms of the delamination inside the microstructure devices are not well understood and difficult to reveal. In order to get a deeper understanding of strain variations at the interface between the viscoelastic polymer and other elastic metal bases under a thermal-hygro environment, the following researches are conducted. Firstly, by combining the generalized Maxwell model and the hygro-mechanical strain equation of bi-layer plate, the equation set for hygro-mechanical strain at the interface of bi-layer plate is established considering the viscoelasticity of epoxy resins. Secondly, two bi-layer plate test pieces are made using elastic copper plates and two different types of viscoelastic epoxy resins (diglycidyl ether of bisphenol F (DGEBF) and cycloaliphatic epoxy resins), and the normal strains at the interface of the two bi-layer plates under a thermal-hygro environment are measured by strain gauges sealed between the epoxy resin layer and the copper plate. Thirdly, by substituting the thermal strain results into the polynomial equations for thermo-mechanical strain at the bi-layer plate interface, the coefficients of thermal expansion of the two epoxy resins at different temperatures are obtained. Finally, multi-parameter fitting of the interface hygro-mechanical strain curves are drawn through programming in MATLAB software based on the genetic algorithm, and the shear modulus and relaxation time of the two viscoelastic epoxy resins are obtained. This paper's experiment and calculation results reveal the relationship between time-dependent strain and delamination of plastic packaged devices at polymer/copper interface under a thermal-hygro environment, and provide a valuable reference to improve the reliability of plastic packaged devices.

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Simulating moisture diffusion in polymers using thermal-moisture analogy

Cited by 4 publications

References 6 publications

Chitosan‐nanocomposites as a food active packaging: Effect of addition of tocopherol and modified montmorillonite

Chitosan‐nanocomposites as a food active packaging: Effect of addition of tocopherol and modified montmorillonite

Complex damage mechanisms and roughness evolution of wind turbine blade surface: Multiphysics and stochastic effect modelling

Research on the relationship between time-dependent strains and delamination of plastic packaged devices at polymer/copper interface under thermal-hygro environments

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