Simulating the dynamic electrothermal behavior of power electronic circuits and systems

Hefner, Allen R.; Blackburn, David L.

doi:10.1109/63.261007

Cited by 119 publications

(34 citation statements)

References 10 publications

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“…In the thermal network models, the heat flow is defined as the through variable and the temperature as the across variable, analogous to the electrical current and voltage respectively. Each of the elements in the thermal network can be represented by an equivalent electrical circuit model for simulation, as described previously by Hefner and Blackburn [5] and Hsu and Vu-Quoc [36], [37].…”

Section: F Modeling the Thermal Behavior Of The Magnetic Componentmentioning

confidence: 99%

“…2) Thermal Conduction Model: Snelling [35] provides the general expression for the calculation of the conduction of heat through a lamina and hence the effective thermal resistance for a magnetic core as given in (5), where is the elemental lamina thickness, is the thermal conductivity and is the cross-sectional area (5) Practical magnetic materials are usually of a more complex shape and this requires some analysis, again described by Snelling [35], to calculate the effective thermal resistance of the material. In the magnetic core, the power source is distributed throughout the volume.…”

Section: F Modeling the Thermal Behavior Of The Magnetic Componentmentioning

confidence: 99%

“…3) Modeling Power Loss in Magnetic Components: Hefner and Blackburn [5] and Hsu and Vu-Quoc [36], [37] have described how electrical semiconductor devices can be linked dynamically with a lumped thermal network for simulation. This method operates on the principle that the power in the electric circuit can be instantaneously calculated from the resistive elements directly.…”

Section: ) Choice Of Core Modelmentioning

confidence: 99%

“…A similar approach has been used to model the relationship between power switching devices and thermal components, such as heatsinks, as shown by Hefner [4] and Hefner and Blackburn [5]. Hsu and Vu-Quoc [36], [37] have developed the use of finite element analysis to characterize detailed models for dynamic electro-thermal simulation.…”

mentioning

confidence: 99%

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Simulation of magnetic component models in electric circuits including dynamic thermal effects

Wilson

Ross

Brown

2002

IEEE Trans. Power Electron.

107

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Abstract-It is essential in the simulation of power electronics applications to model magnetic components accurately. In addition to modeling the nonlinear hysteresis behavior, eddy currents and winding losses must be included to provide a realistic model. In practice the losses in magnetic components give rise to significant temperature increases which can lead to major changes in the component behavior. In this paper a model of magnetic components is presented which integrates a nonlinear model of hysteresis, electro-magnetic windings and thermal behavior in a single model for use in circuit simulation of power electronics systems. Measurements and simulations are presented which demonstrate the accuracy of the approach for the electrical, magnetic and thermal domains across a variety of operating conditions, including static thermal conditions and dynamic self heating.

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Section: F Modeling the Thermal Behavior Of The Magnetic Componentmentioning

confidence: 99%

Section: F Modeling the Thermal Behavior Of The Magnetic Componentmentioning

confidence: 99%

Section: ) Choice Of Core Modelmentioning

confidence: 99%

mentioning

confidence: 99%

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Simulation of magnetic component models in electric circuits including dynamic thermal effects

Wilson

Ross

Brown

2002

IEEE Trans. Power Electron.

107

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“…There has been a wealth of work in the thermal models for electro-thermal analysis of power modules [3][4][5][6][7][8][9][10][11][12][13][14][15]. Finite element method (FEM) and finite difference method (FDM) were commonly employed for the detailed three-dimensional (3D) modeling and accurate simulations of the power packages and/or modules.…”

Section: Introductionmentioning

confidence: 99%

A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module

Castellazzi

Eleffendi

et al. 2018

IEEE Trans. Power Electron.

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AbstractThis paper is concerned with the thermal models which can physically reflect the heat-flow paths in a lightweight three-phase half bridge, two-level SiC power module with 6 MOSFETs and can be used for coupled electro-thermal simulation. The finite element (FE) model was first evaluated and calibrated to provide the raw data for establishing the physical RC network model. It was experimentally verified that the cooling condition of the module mounted on a water cooler can be satisfactorily described by assuming the water cooler as a heat exchange boundary in the FE model. The compact RC network consisting of 115 R and C parameters to predict the transient junction temperatures of the 6 MOSFETS was constructed, where cross-heating effects between the MOSFETs are represented with lateral thermal resistors. A three-step curve fitting method was especially developed to overcome the challenge for extracting the R and C values of the RC network from the selected FE simulation results. The established compact RC network model can physically be correlated with the structure and heat-flow paths in the power module, and was evaluated using the FE simulation results from the power module under realistic switching conditions. It was also integrated into the LTspice model to perform the coupled electrothermal simulation to predict the power losses and junction temperatures of the 6 MOSFETs under switching frequencies from 5 kHz to 100 kHz which demonstrate the good electrothermal performance of the designed power module.Index TermsMOSFETs, SiC power module, finite element methods, RC network, curve fitting, three-phase inverters.

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Simulation of Power Electronic and Motion Control Systems

Mohan¹,

Robbins²,

Aga³

et al. 1996

Power Electronics and Variable Frequency Drives

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Simulating the dynamic electrothermal behavior of power electronic circuits and systems

Cited by 119 publications

References 10 publications

Simulation of magnetic component models in electric circuits including dynamic thermal effects

Simulation of magnetic component models in electric circuits including dynamic thermal effects

A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module

Simulation of Power Electronic and Motion Control Systems

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