Simulation and experimental research on subsurface damage of silicon nitride grinding

Wan, Linlin; Liu, Zhijian; Deng, Zhaohui; Li, Le; Liu, Wei

doi:10.1016/j.ceramint.2018.02.014

Cited by 40 publications

(10 citation statements)

References 18 publications

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“…Their results showed a good surface finish and reduced SSD depth at higher cutting speeds. Similar conclusions were reached during grinding of other hard and brittle materials, such as Si3N4 [17,18], fused silica [19], and SiC [20].…”

Section: (Ii)supporting

confidence: 74%

An analytical model to predict the depth of sub-surface damage for grinding of brittle materials

Yin

Bai

Goel

et al. 2021

CIRP Journal of Manufacturing Science and Technology

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Section: (Ii)supporting

confidence: 74%

An analytical model to predict the depth of sub-surface damage for grinding of brittle materials

Yin

Bai

Goel

et al. 2021

CIRP Journal of Manufacturing Science and Technology

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“…A brittle fracture happens when a point's maximum tensile stress exceeds the limit stress of a single stress state. Its key aim is to extract material by fracturing and friction, then here in the case of tungsten alloy, the damage appears on the workpiece where if the tensile strength exceeds 786 MPa as bending strength material [18]. As a result, the stress on the grinding surface of the workpiece needs to be assessed.…”

Section: Simulation Ssd Depth Resultsmentioning

confidence: 99%

“…The average error between prediction and experiment results was approx-imately 9%, which validated the prediction accuracy and generalization ability of the prediction model. Also, the SSD depth increased with the increment of work-piece speed and grinding depth, while as the speed in-creased, the SSD depth decreased [18].…”

Section: Figure 2 Diagram Of Crack System Caused By a Sharp Indentermentioning

confidence: 94%

Study of Subsurface damage of tungsten alloy in rotary ultrasonic grinding

Turabimana¹,

Karangwa²

2021

eng.pers

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Tungsten alloy is generally used in aerospace, military defense services, the nuclear industry, and other essential fiel ds of manufacturing due to its physical and chemical properties. As the demand for tungsten alloy increases, it dema nds higher requirements for the accuracy, quality, and surface integrity of tungsten alloy products. So, it is of paramo unt importance to study the manufacturing, processing, and testing of tungsten alloys through the power generating du ring machining, the surface, and subsurface of finished products. Grinding is an abrasive machining method that can achieve extremely fine surface finishes while retaining high dimensional and shape precision. However, the process ca uses subsurface damage, which affects the mechanical properties and surface quality of the machined workpiece. In th is paper, the grinding simulations in Abaqus software and experiments on CNC machine on both Rotary Ultrasonic G rinding (RUG) and Conventional Grinding (CG) were carried out by Taguchi experimental design method to study th e different influences of spindle speed, grinding depth, feed rate, ultrasonic frequency and amplitude on subsurface da mage induced in grinding of tungsten alloy. Briefly, simulation and experiment results showed well agreement at the same time present the reduction of subsurface damage depth on ultrasonic grinding compared to conventional grindin g. Also, the increase of grinding depth and feed rate and amplitude generates a high Subsurface Damage depth (SSD depth) where the increasing of spindle speed decreases the SSD depth, but ultrasonic frequency present a little effect on it.

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“…The change of cutting force during the cutting process, including thrust, force ratio, specific energy, and subsurface deformation, was studied in detail, which was significantly affected by the combination of tool geometry and cut depth. Based on the virtual abrasives with a truncated polyhedral shape, Wan et al simulated the SSD depth of silicon nitride [32]. The results of the simulation matched well with the experimental results.…”

Section: Introductionmentioning

confidence: 88%

Analytical Prediction of Subsurface Damages and Surface Quality in Vibration-Assisted Polishing Process of Silicon Carbide Ceramics

et al. 2019

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Subsurface damages and surface roughness are two significant parameters which determine the performance of silicon carbide (SiC) ceramics. Subsurface damages (SSD) induced by conventional polishing could seriously affect the service life of the workpiece. To address this problem, vibration-assisted polishing (VAP) was developed to machine hard and brittle materials, because the vibration-assisted machine (VAM) can increase the critical cutting depth to improve the surface integrity of materials. In this paper, a two-dimensional (2D) VAM system is used to polish SiC ceramics. Moreover, a theoretical SSD model is constructed to predict the SSD. Furthermore, finite element simulation (FEM) is adopted to analyze the effects of different VAP parameters on SSD. Finally, a series of scratches and VAP experiments are conducted on the independent precision polishing machine to investigate the effects of polishing parameters on brittle–ductile transition and SSD.

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Simulation and experimental research on subsurface damage of silicon nitride grinding

Cited by 40 publications

References 18 publications

An analytical model to predict the depth of sub-surface damage for grinding of brittle materials

An analytical model to predict the depth of sub-surface damage for grinding of brittle materials

Study of Subsurface damage of tungsten alloy in rotary ultrasonic grinding

Analytical Prediction of Subsurface Damages and Surface Quality in Vibration-Assisted Polishing Process of Silicon Carbide Ceramics

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