Simulation and experimental study on micro grinding mechanism and machining morphology of ITO conductive glass

Abstract

The analysis of the grinding mechanism of ITO conductive glass is particularly important for revealing material damage and chip formation. This article proposes the removal mechanism of brittle thin film materials during grinding based on the indentation model. And based on the thin film composite structure of ITO conductive glass, a material model in finite element simulation was established. The surface morphology and chip state of ITO conductive glass were studied through microscale grinding experiments. By comparing the simulation results, it has been proven that the ITO film is removed in a brittle fracture mode during the grinding process, while the removal mode of the glass substrate is influenced by the process parameters. The interlayer fracture between the film and substrate will affect the processing quality.