Simulation and feature analysis of modal acoustic emission wave in planar C/SiC composite

Gao, Yong; Xiao, Denghong

doi:10.21595/jve.2017.18173

Cited by 2 publications

(1 citation statement)

References 32 publications

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“…Theoretical studies, however, do not delve into the processes of AE signal formation. When the destruction of CM elements occurs, numerical modeling using the finite element method is employed to simulate stress changes (stress waves) that cause surface displacements resulting in AE waves [23][24][25].…”

Section: Introductionmentioning

confidence: 99%

Acoustic Emission during Non-Uniform Progression of Processes in Composite Failure According to the Von Mises Criterion

Filonenko,

Stakhova,

Bekö

et al. 2024

J. Compos. Sci.

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In the study, based on the model of acoustic emission during the destruction of a composite material by shear force according to the Von Mises criterion, the effect of non-uniformity of the destruction process on the generated acoustic emission signal is simulated. The study under the accepted modeling conditions allows us to determine the patterns of changes in the amplitude envelope of acoustic emission signals at various stages of developing processes. In theoretical and experimental studies of acoustic emission signals when searching for patterns in their parameter changes and developing methods for monitoring or diagnosing the state of composite materials, the problem lies in the interpretation of recorded information. This issue arises from the complexity and diversity of processes occurring in the material structure at micro and macro levels, and the high sensitivity of the acoustic emission method to these processes, wherein structural changes lead to observable alterations in the characteristics of acoustic emissions. Solving this problem requires both theoretical and experimental studies to understand the influence of various factors on the characteristics of the generated acoustic emission. The results of the presented study can be used to assess the condition of composite materials and structures, such as bridges, e.g., in terms of defectiveness, property dispersion, damage during operation, and other characteristics.

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Section: Introductionmentioning

confidence: 99%

Acoustic Emission during Non-Uniform Progression of Processes in Composite Failure According to the Von Mises Criterion

Filonenko,

Stakhova,

Bekö

et al. 2024

J. Compos. Sci.

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Detection of defects in printed circuit boards by the acoustic emission method

Uvaysov,

Luu,

Nguyen

et al. 2024

Rossijskij tehnologičeskij žurnal

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Objectives. Defects in the form of layering may occur during lamination in the production of multilayer printed circuit boards (MPCB). These defects cannot be detected by optical and electrical methods of output control. However, they can lead to breaches of the mechanical mode of operation and failures while running radioelectronic devices. In order to detect such defects, the acoustic emission (AE) method is proposed. This is based on the occurrence and propagation of acoustic waves in MPCBs caused by the presence of defects. The aim of this study is to investigate the possibility of using the AE method to detect defects in multilayer printed circuit boards. These defects can occur, in particular, in the lamination process.Methods. A mechanical processes modeling program (for research on the MPCB model) and various samples of two-layer printed circuit boards with pre-introduced defects (for experimental studies) were used to study the propagation of acoustic signals in the MPCB in the presence of defects. A solenoid mounted on the MPCB was used as a source of acoustic signals, while a piezoelectric sensor was used to receive signals. Data processing was carried out by comparing AE signals obtained for a serviceable MPCB sample and for MPCB samples with defects.Results. Simulation of the acoustic signal propagation in MPCBs in serviceable and faulty (with a rectangular defect in the form of delamination) states was carried out to show the difference in the received signals at the sensor installation point. Experimental studies were also conducted to examine the AE method applicability for detecting defects of various sizes and quantities.Conclusions. The studies demonstrated that the AE method allows the presence of defects in MPCB occurring during the lamination process to be detected effectively and reliably. This study proposes a new approach to non-destructive testing of MPCB using the AE method. This method significantly increases the reliability of MPCBs and the efficiency of their production processes.

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Simulation and feature analysis of modal acoustic emission wave in planar C/SiC composite

Cited by 2 publications

References 32 publications

Acoustic Emission during Non-Uniform Progression of Processes in Composite Failure According to the Von Mises Criterion

Acoustic Emission during Non-Uniform Progression of Processes in Composite Failure According to the Von Mises Criterion

Detection of defects in printed circuit boards by the acoustic emission method

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