Simulation and Printing of Microdroplets Using Straight Electrode-Based Electrohydrodynamic Jet for Flexible Substrate

Abstract

Electrohydrodynamic jet (e-jet) printing is a modern and decent fabrication method widely used to print high-resolution versatile microstructures with features down to 10 μm. It is currently difficult to break nanoscale resolution (<100 nm) due to limitations of fluid properties, voltage variations, and needle shapes. This paper presents developments in drop-on-demand e-jet printing based on a phase-field method using a novel combined needle and straight electrode to print on a flexible PET substrate. Initially, the simulation was performed to form a stable cone jet by coupling an innovative straight electrode parallel to a combined needle that directs the generation of droplets at optimized parameters, such as f = 8.6 × 10−10 m3s−1, Vn = 9.0 kV, and Vs = 4.5 kV. Subsequently, printing experiments were performed using optimized processing parameters and all similar simulation conditions. Microdroplets smaller than 13 μm were directly printed on PET substrate. The model is considered unique and powerful for printing versatile microstructures on polymeric substrates. The presented method is useful for MEMS technology to fabricate various devices, such as accelerometers, smartphones, gyroscopes, sensors, and actuators.

Predicting energy consumption through the LEAP model based on LMDI technique along with economic analysis: A case study

“…For example, Goli et al (2022a) proposed a mathematical model and solution method to optimize the supply chain for organ transplants under shipment timing uncertainty. For the location, allocation, and distribution of organ transplant centers, a possibilistic programming model and simulation-based solution approach (Wang et al, 2022) were created. The proposed mathematical approach reduced overall costs by taking into account the fuzzy uncertainty of organ demand and transportation time.…”

Editorial for the Special Issue on Structural Analyses and Designs for Flexible/Stretchable Electronics

“…Twelve articles are by authors from China and one paper each was contributed by authors from Germany, Italy, Poland, and Russia. A comprehensive range of aspects related to the structural analyses, designs, and fabrication of flexible/stretchable devices and smart materials are covered, including mechanical analyses of flexible/stretchable devices [ 1 , 2 , 3 , 4 ], thermal analyses of flexible heaters [ 5 , 6 , 7 , 8 , 9 ], mechanical–conductive analyses of island-type structures in flexible/stretchable devices [ 10 ], thermo-mechanical analyses and designs of morphing aircraft structures [ 11 ], adhesive bonding technology for flexible substrates [ 12 ], electrohydrodynamic jet printing technology for flexible substrates [ 13 ], process parameters’ influence on the resistance of 3D-printed electrically conductive structures [ 14 ], and recent advances in flexible radio frequency microelectromechanical systems (RE MEMS) [ 15 ] and triboelectric nanogenerators (TENGs) [ 16 ].…”

“…Saleh et al [ 12 ] studied the isotropic conductive adhesive and the solder and lifetime characterization of an assembly of surface-mounted devices on flexible substrates and summarized the better adhesive surfaces for future structural designs. Wang et al [ 13 ] reported on the simulation and printing of microdroplets using a straight electrode-based electrohydrodynamic jet for the flexible substrate, proving the feasibility and high merit of this fabrication technology. Dembek et al [ 14 ] investigated the influences of printing parameters including the print temperature, layer height, nozzle diameter, and extrusion rate on the resistance of 3D-printed conductive composite structures and provided essential guidance on printing parameters to reduce the resistance of printed paths for structural electronics.…”