2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015
DOI: 10.1109/ectc.2015.7159859
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Simulation driven design of novel integrated circuits - Part 2: Constitutive material modeling of thermosets

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Cited by 6 publications
(1 citation statement)
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“…The optimum combination of properties of molding compound which results in a minimwn stress state of the critical components in the module is selected. -Material modeling [11] As the reliability of power electronics devices are largely influenced by the thermo-mechanical behaviour apart from the geometric design, selected materials & method of manufacturing [6]. In order to predict the reliability of PEMs effectively, it is crucial that the failure mechanisms are well understood and the lifetime predicted accurately.…”
Section: Introductionmentioning
confidence: 99%
“…The optimum combination of properties of molding compound which results in a minimwn stress state of the critical components in the module is selected. -Material modeling [11] As the reliability of power electronics devices are largely influenced by the thermo-mechanical behaviour apart from the geometric design, selected materials & method of manufacturing [6]. In order to predict the reliability of PEMs effectively, it is crucial that the failure mechanisms are well understood and the lifetime predicted accurately.…”
Section: Introductionmentioning
confidence: 99%