Simulation methods for micro-electro-mechanical structures (MEMS) with application to a microtweezer

Shi, Fan; Ramesh, Palghat; Mukherjee, Subrata

doi:10.1016/0045-7949(95)00007-4

Cited by 67 publications

(37 citation statements)

References 15 publications

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“…To investigate the instability of the switches, the numerical finite element method was used. The total potential energy of the system consists of the contributions from the mechanical energy [44][45][46] due to the deflection of the wire and the electrostatic energy 10,45 due to the capacitive interaction between the wires. This energy can be described as follows:…”

Section: Results and Discussion Manufacturing 3d Cu Microswitches On mentioning

confidence: 99%

Vertical, capacitive microelectromechanical switches produced via direct writing of copper wires

Guo

Chen

et al. 2016

Microsyst Nanoeng

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Three-dimensional (3D) direct writing based on the meniscus-confined electrodeposition of copper metal wires was used in this study to develop vertical capacitive microelectromechanical switches. Vertical microelectromechanical switches reduce the form factor and increase the area density of such devices in integrated circuits. We studied the electromechanical characteristics of such vertical switches by exploring the dependence of switching voltage on various device structures, particularly with regard to the length, wire diameter, and the distance between the two wires. A simple model was found to match the experimental measurements made in this study. We found that the electrodeposited copper microwires exhibit a good elastic modulus close to that of bulk copper. By optimizing the 3D structure of the electrodes, a volatile electromechanical switch with a sub-5 V switching voltage was demonstrated in a vertical microscale switch with a gap distance as small as 100 nm created with a pair of copper wires with diameters of~1 μm and heights of 25 μm. This study establishes an innovative approach to construct microelectromechanical systems with arbitrary 3D microwire structures for various applications, including the demonstrated volatile and nonvolatile microswitches.

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Section: Results and Discussion Manufacturing 3d Cu Microswitches On mentioning

confidence: 99%

Vertical, capacitive microelectromechanical switches produced via direct writing of copper wires

Guo

Chen

et al. 2016

Microsyst Nanoeng

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“…However, due to the difficulty of no linearity between the actuator deflection and the electrostatic force, this residual vibration phenomenon has been studied in only a very few papers, as has the effect of electrode shape on the residual response. Substituting (7), (8), and (9) into Hamilton's equation: …”

Section: Dynamic Behavior Of Microactuatorsmentioning

confidence: 99%

“…Wang [7] applied a feedback control for suppressing the vibration of actuator beams in an electrostatic actuator. Shi et al [8] combined an exterior boundary element method for electrostatics and a finite element method for elasticity to evaluate the coupling effect between the electrostatic force and the elastic deformation. Gretillat et al [9] employed three-dimensional finite element programs to simulate the dynamics of a nonlinear actuator, considering the effect of squeeze-film damping.…”

Section: Introductionmentioning

confidence: 99%

The Effect of Residual Stress on the Electromechanical Behavior of Electrostatic Microactuators

Hsu

2008

Active and Passive Electronic Components

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This work simulates the nonlinear electromechanical behavior of different electrostatic microactuators. It applies the differential quadrature method, Hamilton's principle, and Wilson-θ integration method to derive the equations of motion of electrostatic microactuators and find a solution to these equations. Nonlinear equation difficulties are overcome by using the differential quadrature method. The stresses of electrostatic actuators are determined, and the residual stress effects of electrostatic microactuators are simulated.

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“…This mass-spring model has persisted in the MEMS/NEMS literature and has been rediscovered and discussed by numerous authors, [12,9,15,18,7,13,11,17]. Nevertheless, the mathematical analysis of this canonical model has remained primitive.…”

mentioning

confidence: 99%

“…Nevertheless, the mathematical analysis of this canonical model has remained primitive. Typically, authors have restricted their attention to steady-state solutions, [12], relied upon numerical simulation for dynamical information, [7], or have utilized perturbation methods to study approximate dynamics in some region of parameter space, [18].…”

mentioning

confidence: 99%

Dynamics of a Canonical Electrostatic MEMS/NEMS System

Pelesko

2007

J Dyn Diff Equat

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Simulation methods for micro-electro-mechanical structures (MEMS) with application to a microtweezer

Cited by 67 publications

References 15 publications

Vertical, capacitive microelectromechanical switches produced via direct writing of copper wires

Vertical, capacitive microelectromechanical switches produced via direct writing of copper wires

The Effect of Residual Stress on the Electromechanical Behavior of Electrostatic Microactuators

Dynamics of a Canonical Electrostatic MEMS/NEMS System

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