2015
DOI: 10.1007/s00542-015-2580-x
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Simulation of a high-power LED lamp for the evaluation and design of heat dissipation mechanisms

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Cited by 5 publications
(2 citation statements)
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“…Numerous studies have focused on heat sinks to cool high-power LED lamps [8][9][10][11][12][13][14][15]. Yu et al [8,9] compared the effects of the number of fins, fin length, fin height, and heat flux on the thermal resistance and the heat transfer coefficient only in plate-fin heat sinks.…”
Section: Introductionmentioning
confidence: 99%
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“…Numerous studies have focused on heat sinks to cool high-power LED lamps [8][9][10][11][12][13][14][15]. Yu et al [8,9] compared the effects of the number of fins, fin length, fin height, and heat flux on the thermal resistance and the heat transfer coefficient only in plate-fin heat sinks.…”
Section: Introductionmentioning
confidence: 99%
“…The staggered pin-fin radial heat sink has been identified as the optimal configuration, demonstrating improved thermal performance by up to 10% while maintaining the same mass or reducing the mass by up to 12% for a given thermal resistance. Huang et al [14] developed a simulation method for LED lamps in order to investigate thermal and fluid fields inside a lamp. The chip temperature and air velocity inside the shell of the LED lamp were shown to decrease with an increase in the number of fins.…”
Section: Introductionmentioning
confidence: 99%