2023
DOI: 10.1016/j.rio.2023.100353
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Simulation of CdS/p-Si/p+-Si and ZnO/CdS/p-Si/p+-Si heterojunction solar cells

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Cited by 7 publications
(2 citation statements)
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“…, d 1 is thin-film thickness, n 1 is thin-film refractive index, n 0 is the air refractive index, n 2 is substrate refractive index, and θ is light incidence angle. [24][25][26] Figure 3 illustrates the relationship between annealing temperature and carrier density, as well as resistivity values obtained from Hall measurements. According to Figure 3a, the carrier density obtained at 300 °C was 4.982 Â 10 14 cm À3 and increasing the annealing temperature to 500 °C resulted in an increase in the carrier density to 1.256 Â 10 15 cm À3 .…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…, d 1 is thin-film thickness, n 1 is thin-film refractive index, n 0 is the air refractive index, n 2 is substrate refractive index, and θ is light incidence angle. [24][25][26] Figure 3 illustrates the relationship between annealing temperature and carrier density, as well as resistivity values obtained from Hall measurements. According to Figure 3a, the carrier density obtained at 300 °C was 4.982 Â 10 14 cm À3 and increasing the annealing temperature to 500 °C resulted in an increase in the carrier density to 1.256 Â 10 15 cm À3 .…”
Section: Resultsmentioning
confidence: 99%
“…= \frac{r_{1}^{2} + r_{2}^{2} + 2 r_{1} r_{2} \text{cos} 2 \theta}{1 + r_{1}^{2} r_{2}^{2} + 2 r_{1} r_{2} \text{cos} 2 \theta}$$where r1=n0n1n0+n1$r_{1} = \frac{n_{0} - n_{1}}{n_{0} + n_{1}}$, r2=n1n2n1+n2$r_{2} = \frac{n_{1} - n_{2}}{n_{1} + n_{2}}$, θ=2πn1d1λ$\theta = \frac{2 \pi n_{1} d_{1}}{\lambda}$, d 1 is thin‐film thickness, n 1 is thin‐film refractive index, n 0 is the air refractive index, n 2 is substrate refractive index, and θ is light incidence angle. [ 24–26 ] Figure illustrates the relationship between annealing temperature and carrier density, as well as resistivity values obtained from Hall measurements. According to Figure 3a, the carrier density obtained at 300 °C was 4.982 × 10 14 cm −3 and increasing the annealing temperature to 500 °C resulted in an increase in the carrier density to 1.256 × 10 15 cm −3 .…”
Section: Resultsmentioning
confidence: 99%