1998
DOI: 10.1109/22.739206
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Simulation of high-speed interconnects in a multilayered medium in the presence of incident field

Abstract: Simulation of high-speed circuits and interconnects in the presence of incident electromagnetic interference is becoming an important step in the design cycle. An accurate and efficient method for the analysis of incident field coupling to traces in inhomogeneous medium is described. The method is based on the application of the physical optics technique. An interconnect circuit simulation stamp is derived. This stamp provides an easy link to current simulators and to recently developed model reduction techniq… Show more

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Cited by 34 publications
(23 citation statements)
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“…This problem was mentioned in [7], and a way of solving it in the frequency domain was outlined in [3,8]. Based on the general theory of planarly layered media [9], analytical formulas were given in [3] for horizontal electric field component acting on the substrate surface and vertical electric field component in the substrate (Fig.…”
Section: Introductionmentioning
confidence: 99%
“…This problem was mentioned in [7], and a way of solving it in the frequency domain was outlined in [3,8]. Based on the general theory of planarly layered media [9], analytical formulas were given in [3] for horizontal electric field component acting on the substrate surface and vertical electric field component in the substrate (Fig.…”
Section: Introductionmentioning
confidence: 99%
“…Traditional multiconductor transmission systems in high-speed digital systems are facing the difficulties of insufficient signal-to-crosstalk ratio at high frequency, which are caused by nonnegligible conductor loss and near-end and far-end coupling from adjacent conductors. Recent research of highspeed digital interconnects has been concentrated on the printed traces in IC packages or on printed circuit boards [1][2][3]. However, multiconductor cables are widely applied to interconnect digital subsystems and CATV or audio to digital interfaces.…”
Section: Introductionmentioning
confidence: 99%
“…The coupling of the external field to one interconnect in inhomogeneous media has been discussed extensively in [18,19] and for parallel traces in [20][21][22][23]. As explained earlier, the used methods in parallel case can not be applied for microstrip crossovers.…”
mentioning
confidence: 97%