Simulation of microloading and ARDE in DRIE

Gosálvez, Miguel A.; Zhou, Yadong; Zhang, Y.; Zhang, G.; Li, Yinggang; Xing, Yan

doi:10.1109/transducers.2015.7181158

Cited by 9 publications

(7 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Moreover, unlike MEMS, usually only one particular critical dimension of the grating pattern has really a major impact on the etch rate, which is the period of the grating lines. Therefore, the conclusions from previous studies [ 17 , 22 , 23 , 24 , 25 ] are not fully representative of our application. The main reason for this is the fact that most of the DRIE applications like MEMS are targeted at achieving uniform depth for features with different sizes.…”

Section: Introductionmentioning

confidence: 71%

Towards the Fabrication of High-Aspect-Ratio Silicon Gratings by Deep Reactive Ion Etching

et al. 2020

View full text Add to dashboard Cite

The key optical components of X-ray grating interferometry are gratings, whose profile requirements play the most critical role in acquiring high quality images. The difficulty of etching grating lines with high aspect ratios when the pitch is in the range of a few micrometers has greatly limited imaging applications based on X-ray grating interferometry. A high etching rate with low aspect ratio dependence is crucial for higher X-ray energy applications and good profile control by deep reactive ion etching of grating patterns. To achieve this goal, a modified Coburn–Winters model was applied in order to study the influence of key etching parameters, such as chamber pressure and etching power. The recipe for deep reactive ion etching was carefully fine-tuned based on the experimental results. Silicon gratings with an area of 70 × 70 mm2, pitch size of 1.2 and 2 μm were fabricated using the optimized process with aspect ratio α of ~67 and 77, respectively.

show abstract

Section: Introductionmentioning

confidence: 71%

Towards the Fabrication of High-Aspect-Ratio Silicon Gratings by Deep Reactive Ion Etching

et al. 2020

View full text Add to dashboard Cite

show abstract

“…Firstly, the pattern depths on the Si master molds could differ due to the micro-loading and the aspect ratio dependent etching (ARDE) effects, which cause the Si etch rate to be dependent on the density and A.R. of the micro-structures, respectively [ 51 , 52 , 53 ]. Secondly, it could be that the flexible PDMS patterns are stretched during peeling from the Si mold (possibly the case for the PDMS-PIL samples) or have shrunk during curing (possibly the case for the PDMS-C-RESS samples).…”

Section: Resultsmentioning

confidence: 99%

Fabrication of High Aspect Ratio Micro-Structures with Superhydrophobic and Oleophobic Properties by Using Large-Area Roll-to-Plate Nanoimprint Lithography

Atthi

Dielen²,

Sripumkhai

et al. 2021

Nanomaterials

View full text Add to dashboard Cite

Bio-inspired surfaces with superamphiphobic properties are well known as effective candidates for antifouling technology. However, the limitation of large-area mastering, patterning and pattern collapsing upon physical contact are the bottleneck for practical utilization in marine and medical applications. In this study, a roll-to-plate nanoimprint lithography (R2P NIL) process using Morphotonics’ automated Portis NIL600 tool was used to replicate high aspect ratio (5.0) micro-structures via reusable intermediate flexible stamps that were fabricated from silicon master molds. Two types of Morphotonics’ in-house UV-curable resins were used to replicate a micro-pillar (PIL) and circular rings with eight stripe supporters (C-RESS) micro-structure onto polycarbonate (PC) and polyethylene terephthalate (PET) foil substrates. The pattern quality and surface wettability was compared to a conventional polydimethylsiloxane (PDMS) soft lithography process. It was found that the heights of the R2P NIL replicated PIL and C-RESS patterns deviated less than 6% and 5% from the pattern design, respectively. Moreover, the surface wettability of the imprinted PIL and C-RESS patterns was found to be superhydro- and oleophobic and hydro- and oleophobic, respectively, with good robustness for the C-RESS micro-structure. Therefore, the R2P NIL process is expected to be a promising method to fabricate robust C-RESS micro-structures for large-scale anti-biofouling application.

show abstract

“…Furthermore, the loading effect should be considered in this simulator [ 22 ]. Usually the aspect ratio dependent etching or RIE lag influence the depth of the trench due to its own sizes exposed to the plasma.…”

Section: Simulation and Experimental Resultsmentioning

confidence: 99%

Three-Dimensional Simulation of DRIE Process Based on the Narrow Band Level Set and Monte Carlo Method

Zhou

Su³

et al. 2018

Micromachines

View full text Add to dashboard Cite

A three-dimensional topography simulation of deep reactive ion etching (DRIE) is developed based on the narrow band level set method for surface evolution and Monte Carlo method for flux distribution. The advanced level set method is implemented to simulate the time-related movements of etched surface. In the meanwhile, accelerated by ray tracing algorithm, the Monte Carlo method incorporates all dominant physical and chemical mechanisms such as ion-enhanced etching, ballistic transport, ion scattering, and sidewall passivation. The modified models of charged particles and neutral particles are epitomized to determine the contributions of etching rate. The effects such as scalloping effect and lag effect are investigated in simulations and experiments. Besides, the quantitative analyses are conducted to measure the simulation error. Finally, this simulator will be served as an accurate prediction tool for some MEMS fabrications.

show abstract

Simulation of microloading and ARDE in DRIE

Cited by 9 publications

References 13 publications

Towards the Fabrication of High-Aspect-Ratio Silicon Gratings by Deep Reactive Ion Etching

Towards the Fabrication of High-Aspect-Ratio Silicon Gratings by Deep Reactive Ion Etching

Fabrication of High Aspect Ratio Micro-Structures with Superhydrophobic and Oleophobic Properties by Using Large-Area Roll-to-Plate Nanoimprint Lithography

Three-Dimensional Simulation of DRIE Process Based on the Narrow Band Level Set and Monte Carlo Method

Contact Info

Product

Resources

About