The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) 2014
DOI: 10.1109/nems.2014.6908888
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Simulation of piezoelectric plasma micro-thruster

Abstract: A piezoelectric plasma micro-thruster (PPMT) is being developed as a thruster for attitude adjustment of nano-satellites. The PPMT consists of a RF driven PZT film operating as a stepup voltage transformer, which can ionize neutrals and accelerate ions and electrons in plasma. The PPMT was driven with a low voltage through the thickness at the resonance frequency in the radial direction. To simulate operation of the PPMT, a RF pulse was applied to the base of the PZT and corresponding output voltages within th… Show more

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Cited by 1 publication
(2 citation statements)
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“…15,16 However, according to the Stoney formula, affected by the steadiness of substrate, the in situ stress measurement of the nanoscale deposition layer challenges the conventional experimental methods. 17 (see section S1 is available online at stacks.iop.org/ JES/167/162504/mmedia, Supplementary Information). Moreover, similarly, regarding the complex multi-scale structures of the inserts, it is also very challenging to measure such multi-scale samples as a result of the limited measurement of a specific substrate (a given material type and a given thickness).…”
mentioning
confidence: 99%
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“…15,16 However, according to the Stoney formula, affected by the steadiness of substrate, the in situ stress measurement of the nanoscale deposition layer challenges the conventional experimental methods. 17 (see section S1 is available online at stacks.iop.org/ JES/167/162504/mmedia, Supplementary Information). Moreover, similarly, regarding the complex multi-scale structures of the inserts, it is also very challenging to measure such multi-scale samples as a result of the limited measurement of a specific substrate (a given material type and a given thickness).…”
mentioning
confidence: 99%
“…Most of the substrate thickness is about 100 μm. Wang et al 17 even reduced the silicon thickness to 15 μm and measured the film stress at 30 nm. Although reducing the thickness of silicon wafer and glass can improve the detection capability, expensive cost and fragile property make it difficult to clamp.…”
mentioning
confidence: 99%