1999
DOI: 10.1351/pac199971101863
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Simulation of plasma processes for microelectronic fabrication

Abstract: An approach is presented which allows to predict important characteristics of plasma based surface modi®cation techniques like reactive ion etching (RIE), plasma etching (PE), ionized metal vapor deposition (IPVD), or plasma enhanced physical vapor deposition (PECVD). In a ®rst step, the electrical ®eld in the vicinity of the substrate is calculated by means of a self-consistent plasma boundary sheath model. In a second step, this ®eld is used to calculate the energy and angular distribution of the ions imping… Show more

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Cited by 4 publications
(1 citation statement)
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“…Patterning of solid surfaces with reactive conjugates has found continuous attention, due to broad potential application of those materials for fabrication of optical devices [1], microelectronic materials [2] and biosensors [3]. Among various techniques surface plasmon-modification [4] and ion implantation [5] have been widely used for direct functionalization of solid surfaces with amine or hydroperoxy groups.…”
Section: Introductionmentioning
confidence: 99%
“…Patterning of solid surfaces with reactive conjugates has found continuous attention, due to broad potential application of those materials for fabrication of optical devices [1], microelectronic materials [2] and biosensors [3]. Among various techniques surface plasmon-modification [4] and ion implantation [5] have been widely used for direct functionalization of solid surfaces with amine or hydroperoxy groups.…”
Section: Introductionmentioning
confidence: 99%