2023
DOI: 10.1016/j.aeue.2023.154548
|View full text |Cite
|
Sign up to set email alerts
|

Simulation of substrate coupling for mobile communications SoC – A 20 GHz VCO case study

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2023
2023
2024
2024

Publication Types

Select...
4
1

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 16 publications
0
1
0
Order By: Relevance
“…The transient analysis and the QPSS analysis are large-signal analyses while the envelope following analysis is a small-signal analysis. The QPSS analysis is not capable of adequately capturing the noise signal at the output spectrum and only the intermodulation products and carrier frequencies can be monitored [37]. Transient (TRAN) and Envelope following analysis (ENVLP) are capable of adequately capturing the noise signal integrity at the output frequency spectrum of the VCO and they are only limited by the simulation time and the obtained accuracy.…”
Section: Noise Integrity Simulations In Multiple Time Scale Topologiesmentioning
confidence: 99%
“…The transient analysis and the QPSS analysis are large-signal analyses while the envelope following analysis is a small-signal analysis. The QPSS analysis is not capable of adequately capturing the noise signal at the output spectrum and only the intermodulation products and carrier frequencies can be monitored [37]. Transient (TRAN) and Envelope following analysis (ENVLP) are capable of adequately capturing the noise signal integrity at the output frequency spectrum of the VCO and they are only limited by the simulation time and the obtained accuracy.…”
Section: Noise Integrity Simulations In Multiple Time Scale Topologiesmentioning
confidence: 99%