Simulation of the Effect of Frequency and Aspect Ratio on Ribbon Bond Wire Performance

Abstract

The frequency dependent impedance and power loss are essential in the design of bond wires in power electronics packages. In this paper, the simulation of the effect of frequency and aspect ratio on the performance of the ribbon bond wire is presented. A copper ribbon bond wire is considered and 2D FEM electromagnetic simulation is carried out. The current density, resistance, and power losses obtained for power frequency using simulation are compared with the calculated values. The performance parameters are obtained for the frequency range from 200 Hz to 20 MHz. Also simulation is carried out to obtain the performance of the ribbon bond wires for the aspect ratios 6, 24, 54, 96, and 150.