2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023
DOI: 10.1109/eptc59621.2023.10457685
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Simulation study of the magnetic material patterning on the high frequency planer inductor in 5G device application

Seiya Masuda,
Akihiko Ohtsu,
Tetsushi Miyata
et al.
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