Simulation study on the influence of electronic component heat generation on BGA solder joint thermal fatigue

Yang, Guangzhu; Cai, Wei; Lin, Song; Wang, Tiansheng; Fang, Zheng; Wei, Xiangfu

doi:10.1117/12.3010708

International Conference on Electronic Materials and Information Engineering (EMIE 2023) 2023

DOI: 10.1117/12.3010708

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Simulation study on the influence of electronic component heat generation on BGA solder joint thermal fatigue

Guangzhu Yang,

Wei Cai,

Song Lin

et al.

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Simulation study on the influence of electronic component heat generation on BGA solder joint thermal fatigue

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References 11 publications

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