2021
DOI: 10.1016/j.ijheatmasstransfer.2020.120853
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Simulations of melting performance enhancement for a PCM embedded in metal periodic structures

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Cited by 45 publications
(18 citation statements)
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“…Flow over and through the porous media is encountered in several natural phenomena and a wide range of industrial applications. Cooling of electronic devices with metal foam heat sinks [1,2], energy storage systems [3,4], heat exchangers [5,6], noise control in the aerospace industry [5,7,8], and flow over vegetation in the canopies in environmental engineering [9][10][11] can be a few examples of typical flow over and through the porous media. Remarkable research has been conducted in literature either experimentally or numerically to explore the flow physics over fluid-saturated porous media.…”
Section: Introductionmentioning
confidence: 99%
“…Flow over and through the porous media is encountered in several natural phenomena and a wide range of industrial applications. Cooling of electronic devices with metal foam heat sinks [1,2], energy storage systems [3,4], heat exchangers [5,6], noise control in the aerospace industry [5,7,8], and flow over vegetation in the canopies in environmental engineering [9][10][11] can be a few examples of typical flow over and through the porous media. Remarkable research has been conducted in literature either experimentally or numerically to explore the flow physics over fluid-saturated porous media.…”
Section: Introductionmentioning
confidence: 99%
“…The missing part in the literature is to identify pertinent parameters and investigate their impacts on the heat transfer performance so that an optimised system can be designed regardless of the enhancer and PCM material properties. Hence, this paper is presented to fill this gap using a previously developed periodic structure model [23] .…”
Section: Critical Cell Sizementioning
confidence: 99%
“…Opolot et al [22] investigated the effects of wall thermal contact resistance for such geometry and offered theoretical and numerical results to evaluate and minimize the thermal contact resistance. Zhao et al [23] numerically studied the effects of pore density of a 0.9 porosity periodic structure on the PCM melting time reduction for different ligament materials (copper, aluminium, nickel, and stainless steel). Two different trends of the melting time curves with respect to PPI, i.e., monotonical decline and parabolic, were reported depending on the material (enhancer) properties.…”
Section: Introductionmentioning
confidence: 99%
“…They are often based on either play/design with the tune geometry of the device or system for TES usage [12] or to increase the thermal conductivity of the PCM-based composite. The latter can be achieved by using additions and/or high-conducting particles such as carbon microfibers [13,14], fine materials such as copper [15], graphite [16], aluminum [17], bronze [18], nickel and stainless steel [19], graphene nano-platelets [20], and carbon nanotubes [21].…”
Section: Introductionmentioning
confidence: 99%