Simulations of the influence of rearrangement during sintering

Factors influencing particle agglomeration during solid-state sintering

“…In the numerical simulation, a real mass m i will require the time step Δt to be a very small value, which in turn leads to an expensive simulation time. In order to overcome the drawback, a special technique is adopted in this paper [25,26,34], in which the mass of a particle is scaled up by a factor β, the acceleration and velocity can be reduced by the same order of magnitude without influencing the equilibrium position of each particle. Thus, a relatively large time step can be chosen.…”

“…Due to its natural treatment at a particle length scale, recent discrete element method (DEM) [24][25][26][27] has shown its capability to study the effect of rearrangement not only in macroscopic aspects, such as densification rates [24,26,28], viscosities [26,29], anisotropic sintering [30], constrained sintering [31], but also in microscopic aspect of crack evolution during sintering [26,32]. This method has also shed some lights on our understanding of certain problems about agglomerates.…”

Blister defect formation within partially stabilized zirconia film during constrained sintering

“…This is manifested in local debonding of the film with the substrate. Henrich et al [10] reported that once a defect is formed within a constrained sintering film it is readily to propagate through the thickness due to the presence of large near crack tip tensile stresses. The combination of surface cracking and debonding at the interface will create a free surface across the entire thickness.…”

“…Anisotropic shrinkage in constrained sintering film has been observed in many studies [10][11][12][13][14][15][16][17][18]. Although this phenomenon is obvious in the presence of inclusions and inhomogeneous green density distribution within the pre-sintered film, it also arises when the film is uniformly deposited onto the substrate.…”

“…Although the tensile stresses are not high in magnitude, they can trigger formation of fracture origins in the film as they develop in the very early stages where the particles have not bonded together, i.e., the film is weak [5][6][7][8][9]. Moreover, it is favorable for cracks to propagate further through the entire thickness of a constrained sintering film due to the high tangential sliding constraint that prevents particle rearrangement and induces large near crack tip stresses [10].…”