Simultaneous interpenetrating polymer networks based on epoxy-acrylate combinations

Baidak, Alex; Liégeois, Jean-François; Sperling, L. H.

doi:10.1002/(sici)1099-0488(19970915)35:12<1973::aid-polb12>3.0.co;2-z

Cited by 20 publications

(4 citation statements)

References 9 publications

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Section: Resultsmentioning

confidence: 99%

“…Herein, this effect might be more pronounced as along with the dilution of the acrylate monomer also the radical photoinitiator becomes more diluted (as its concentration was kept constant in relation to the acrylate content). [34,35] Along with FTIR spectroscopy, photo-differential scanning calorimetry (DSC) was performed to investigate the photopolymerization process of dual curable resins at different wavelengths (Figure 4). Here, the enthalpy of the curing of both monomers was monitored to evaluate the orthogonality and the cure behavior under visible (400-500 m) and UV light (365 nm).…”

Section: Photopolymerization Kinetics and Photopolymer Morphologymentioning

confidence: 99%

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Dual‐Wavelength Vat Photopolymerization 3D Printing with Hybrid Acrylate‐Epoxy Resins: Influence of Resin Composition on Microstructure and Mechanical Properties

Cazin,

Plevová,

Alabiso

et al. 2024

Adv Eng Mater

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Dual‐wavelength vat photopolymerization 3D printing represents a convenient technology for the fabrication of objects with heterogeneous and locally controlled mechanical properties. By using two λ‐orthogonal cross‐linking reactions, it is possible to produce soft and stiff photopolymers with a single resin vat by switching the light source. Herein, hybrid acrylate‐epoxy resins are selectively cured by using either visible or UV light. At 405 nm, a free radical curing of the acrylate monomers is induced while irradiation with 365 nm triggers an additional cationic ring opening reaction of the epoxy monomer yielding interpenetrating photopolymer networks. In a comprehensive approach, the influence of the resin composition and the applied wavelength on cure kinetics, film morphology, (thermo)mechanical properties, and printability are studied. Fully separated as well as homogenous network morphologies are obtained depending on the ratio between acrylate and epoxy monomers, cure rate and applied light source (405 vs 365 nm). In general, glass transition temperature, stiffness, and tensile strength of the photopolymers increase with rising epoxy content. In contrast, a higher epoxy concentration in combination with a higher amount of the cationic photoinitiator compromises on the system's orthogonality, giving rise to the important role of the resin composition in dual‐wavelength vat photopolymerization 3D printing.

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Section: Resultsmentioning

confidence: 99%

Section: Photopolymerization Kinetics and Photopolymer Morphologymentioning

confidence: 99%

Dual‐Wavelength Vat Photopolymerization 3D Printing with Hybrid Acrylate‐Epoxy Resins: Influence of Resin Composition on Microstructure and Mechanical Properties

Cazin,

Plevová,

Alabiso

et al. 2024

Adv Eng Mater

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“…This is found in the concept of interpenetrating polymer networks (IPNs) [19], the combination of two or more polymers in which at least one of them is crosslinked. IPNs have been largely investigated in recent years [16,[19][20][21][22][23][24][25][26][27]. The formation of different polymer networks can be a complex phenomenon involving a phase separation and different gelation events, leading to different structural and morphological characteristics and properties depending on polymerization sequence, composition and polymer compatibility, among other factors.…”

Section: Introductionmentioning

confidence: 99%

Enhancement of 3D-Printable Materials by Dual-Curing Procedures

et al. 2020

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Dual-curing thermosetting systems are recently being developed as an alternative to conventional curing systems due to their processing flexibility and the possibility of enhancing the properties of cured parts in single- or multi-stage processing scenarios. Most dual-curing systems currently employed in three-dimensional (3D) printing technologies are aimed at improving the quality and properties of the printed parts. However, further benefit can be obtained from control in the curing sequence, making it possible to obtain partially reacted 3D-printed parts with tailored structure and properties, and to complete the reaction by activation of a second polymerization reaction in a subsequent processing stage. This paves the way for a range of novel applications based on the controlled reactivity and functionality of this intermediate material and the final consolidation of the 3D-printed part after this second processing stage. In this review, different strategies and the latest developments based on the concept of dual-curing are analyzed, with a focus on the enhanced functionality and emerging applications of the processed materials.

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“…These e-beam-cured resins are designed as interpenetrating polymer networks (IPN) [3]. IPNs are polymers that are formed from the independent polymerization of two or more distinct networks, which results in unique molecular and physical microstructures [4]. The final properties of an IPN are very dependent on the composition of the two networks, as well as the polymerization mechanisms and kinetics of each network.…”

Section: Introductionmentioning

confidence: 99%

Interpenetrating Polymer Network (IPN) Adhesives for Electron Beam Cure

Sands¹,

McKnight²,

Fink³

2000

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Electron beam (e-beam) -processed polymer adhesives have historically performed poorly compared to traditional adhesive technologies due to a lack of toughness engineered into these new types of adhesive materials. Consequently, sequential-and simultaneous-interpenetrating polymer networks (seq-IPN and SIN) were developed and characterized. Seq-IPN adhesive pastes demonstrated exceptional lap-shear strengths (approaching 41 MPa) with glass transition temperatures (T g ) of 100-120° C. The sequential polymerization proceeds by first thermally curing the adhesive to the green-strength. The cure kinetics for the C-staged seq-EPNs have been investigated as a function of temperature and cure acceleration. SIN materials are being investigated to develop durable e-beam-curable film adhesives. The primary advantage of SIN film adhesives, compared to cationic e-beam systems, is insensitivity to surface contaminants (e.g., amine and water), which are known to hinder cure in cationic e-beam polymerization. Preliminary results have shown that the SIN e-beam adhesives have excellent properties. Lap-shear strengths exceeding 27.5 MPa with adhesive T g approaching 150° C have been demonstrated on primed aluminum substrates. Structural, kinetic, and adhesive performance data for both seq-IPN and SIN structural adhesives cured by e-beam irradiation are presented. u

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Simultaneous interpenetrating polymer networks based on epoxy-acrylate combinations

Cited by 20 publications

References 9 publications

Dual‐Wavelength Vat Photopolymerization 3D Printing with Hybrid Acrylate‐Epoxy Resins: Influence of Resin Composition on Microstructure and Mechanical Properties

Dual‐Wavelength Vat Photopolymerization 3D Printing with Hybrid Acrylate‐Epoxy Resins: Influence of Resin Composition on Microstructure and Mechanical Properties

Enhancement of 3D-Printable Materials by Dual-Curing Procedures

Interpenetrating Polymer Network (IPN) Adhesives for Electron Beam Cure

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