Simultaneous Reduction of Bulk and Contact Thermal Resistance in High‐Loading Thermal Interface Materials Using Self‐Assembled Monolayers

Abstract

Thermal interface materials (TIMs) play a pivotal role in the transfer of heat from high‐temperature sources, such as CPUs, to heat sinks in power electronics. The effectiveness of grease‐type TIMs is determined by their effective thermal impedance (REFF), which hinges on optimizing both the specific bulk (RB) and contact (RC) thermal resistances. Achieving concurrent optimization of these resistances poses a significant challenge, especially in high filler loading TIMs, typically above 76 vol%. This research leverages interface engineering through Self‐Assembled Monolayers (SAMs) to address this challenge. A substantial decrease in REFF is realized to 0.169 K cm2 W−1, a tenfold enhancement compared to non‐SAM treated TIMs, which exhibit REFF values of 2.265 K cm2 W−1. This leap in performance is primarily ascribed to the reduced surface energy of SAM treated Al2O3, leading to lower particle‐to‐particle Van der Waals forces, thereby improving particle dispersion and strengthening interfacial bonds. Furthermore, longer carbon chains in SAMs result in increased RB, yet a decrease in RC, due to the chains' capacity for enhanced energy absorption and molecular entanglement. The investigation underscores the significance of shorter‐chain SAMs in fine‐tuning thermal resistance, highlighting the crucial role of molecular architecture in the design of advanced TIMs.

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“…6−8 TIMs come in different forms, including thermal pads, thermal greases, thermal gels, and TCAs, depending on their encapsulation state and application method. 2,9,10 Compared to other TIMs, TCAs are more suitable for thermal management due to their versatility. 9−11 Typically, TCAs are created by mixing thermal fillers with a polymer matrix.…”

“…To address this problem, thermal management technologies have been developed for use in applications like supercomputing and electric vehicles to enhance device performance and longevity. − Within this context, TIMs play a crucial role in extending device lifespan. TIMs are a key component of effective thermal management, designed to transmit heat from circuits to the surrounding environment by filling the unavoidable air gaps between heat-generating devices and their radiator contact surfaces. − TIMs come in different forms, including thermal pads, thermal greases, thermal gels, and TCAs, depending on their encapsulation state and application method. ,, Compared to other TIMs, TCAs are more suitable for thermal management due to their versatility. − Typically, TCAs are created by mixing thermal fillers with a polymer matrix. They are applied to the surface of a heating device or radiator using techniques such as coating, dispensing, or screen printing.…”