2021 IEEE International Electron Devices Meeting (IEDM) 2021
DOI: 10.1109/iedm19574.2021.9720661
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Single-Chip Beam Scanner LiDAR Module for 20-m Imaging

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Cited by 7 publications
(5 citation statements)
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“…The on-chip SOA is also expected to enhance the output beam power, and its initial feasibility has been presented [2,20]. Recently, Authors have demonstrated rapid progress in LiDAR performance up to 30m range, 20-fps frame rage, 120 × 20 resolution, and 26 × 3.6° FOV, thanks to the on-chip SOAs and TLD, all based on the CRS design [24][25][26][27][28][29]. Using the presented OPA design methodology powered by the emerging on-chip devices, we believe that the Si-photonics-based OPA is one of the promising approaches towards low-cost and compact LiDAR commercialization.…”
Section: Discussionmentioning
confidence: 99%
“…The on-chip SOA is also expected to enhance the output beam power, and its initial feasibility has been presented [2,20]. Recently, Authors have demonstrated rapid progress in LiDAR performance up to 30m range, 20-fps frame rage, 120 × 20 resolution, and 26 × 3.6° FOV, thanks to the on-chip SOAs and TLD, all based on the CRS design [24][25][26][27][28][29]. Using the presented OPA design methodology powered by the emerging on-chip devices, we believe that the Si-photonics-based OPA is one of the promising approaches towards low-cost and compact LiDAR commercialization.…”
Section: Discussionmentioning
confidence: 99%
“…From an industry perspective, a major trend in the development of photonic integrated circuits(PICs) including the DFB LD is the emergence of silicon(Si) photonics, which leverages the complementary-metal-oxide-semiconductor(CMOS) infrastructure of the Si industry [10][11][12][13][14][15][16][17][18][19][20][21][22][23]. In particular, the recently emerging III/V-on-Si platform enables single-chip integration including the light source, so expectations are rising for the commoditization of PICs in various applications including Datacenter and Light detection and ranging(LiDAR) [17][18][19][20][21][22][23][24]. Therefore, recent light source development tends to pursue single-chip integration along with various photonic devices on top of a Si substrate instead of a conventional III/V one.…”
Section: Introductionmentioning
confidence: 99%
“…In order to overcome the limitations of mechanical LiDAR, solid-state LiDAR such as microelectromechanical systems (MEMS) [1], flash LiDAR [2], and optical phased arrays (OPA) [3]; have been investigated in order to overcome the limitation of mechanical LiDAR. Recently, optical phased array-based LiDAR has been actively researched due to its advantages in terms of scanning speed and compactness [4][5][6][7]. The OPA can be designed and fabricated on a silicon nitride-on-insulator or a silicon-on-insulator platform.…”
Section: Introductionmentioning
confidence: 99%
“…As for Si OPA, it can provide a high contrast index waveguide which reduces the size of OPA, allows the ion implantation process, and can be fabricated with a complementary metal-oxide-semiconductor (CMOS)-compatible process. As a result, Si OPA has a high potential for development and has been subjected to a number of studies on LiDAR application [3,6,7].…”
Section: Introductionmentioning
confidence: 99%
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