1995
DOI: 10.1143/jjap.34.1282
|View full text |Cite
|
Sign up to set email alerts
|

Single-Chip Integration of Light-Emitting Diode, Waveguide and Micromirrors

Abstract: Fundamental technologies for optical interconnection on a Si LSI chip have been developed using conventional silicon process technologies. The optical waveguides with SiO x N y core and SiO2 cladding layers and Al micromirrors to change the light propagation direction have been fabricated by low-temperature deposition. Moreover, the singl… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
4
0

Year Published

1997
1997
2018
2018

Publication Types

Select...
6
1
1

Relationship

0
8

Authors

Journals

citations
Cited by 12 publications
(4 citation statements)
references
References 2 publications
0
4
0
Order By: Relevance
“…This amounts to an external LED−photodetector optical coupling efficiency of 40%, since the LED quantum efficiency was measured to be 2 × 10 -7 . Considering the fiber thickness and the LED spectral width, which was approximately 500−800 nm (Figure B, curve 1), such coupling efficiency is excellent and should be compared with the 1% coupling efficiency obtained on thicker fibers when integrating compound semiconductor LEDs on silicon by microbonding techniques . Additionally, it can be further improved by increasing the deposited silicon dioxide thickness and the associated spacer radius.…”
Section: Resultsmentioning
confidence: 91%
“…This amounts to an external LED−photodetector optical coupling efficiency of 40%, since the LED quantum efficiency was measured to be 2 × 10 -7 . Considering the fiber thickness and the LED spectral width, which was approximately 500−800 nm (Figure B, curve 1), such coupling efficiency is excellent and should be compared with the 1% coupling efficiency obtained on thicker fibers when integrating compound semiconductor LEDs on silicon by microbonding techniques . Additionally, it can be further improved by increasing the deposited silicon dioxide thickness and the associated spacer radius.…”
Section: Resultsmentioning
confidence: 91%
“…Despite the aforementioned efforts for the integration of optical components onto the same chip with the transducer, the light source was not integrated and, even with the more compact broad-band sources, the device size remained substantial. Moreover, the light coupled to the device was just a little fraction of the incident light [125]. The only reliable solution provided so far to this problem was the implementation of silicon light emitting diodes (LED) integrated onto the same silicon chip with planar silicon nitride waveguides [126] as light sources.…”
Section: Monolithically Integrated Broad-band Optoelectronic Transducersmentioning
confidence: 99%
“…Despite the aforementioned efforts for integration of optical components onto the same chip with the transducer, the light source was not integrated and, even with the more compact broad-band sources, the device size remained substantial. Moreover, the light coupled to the device was just a little fraction of the incident light [116]. The only reliable solution provided so far to this problem was the implementation as light sources of silicon light emitting diodes (LED) integrated onto the same silicon chip with planar silicon nitride waveguides [117,[119][120][121][122][123][124][125][126][127][128][129][130][131].…”
Section: Monolithically Integrated Broad-band Optoelectronic Transducersmentioning
confidence: 99%