Single chip wireless condition monitoring of power semiconductor modules

Nilsson, Joakim; Borg, J.; Johansson, Jonny

doi:10.1109/norchip.2015.7364407

Cited by 5 publications

(7 citation statements)

References 8 publications

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“…Applications for such circuits exist in the field of wireless transfer of power directly to a single-chip system, where the RF inductor is integrated on the die. Examples of applications include implantable chips in humans for biomedical purposes [2,3], and sensors for condition monitoring of power semiconductors, where a wireless power supply and communication interface provides galvanic isolation from the high-voltage power semiconductors [4,5].…”

Section: Introductionmentioning

confidence: 99%

Maximal Q Factor for an On-Chip, Fuse-Based Trimmable Capacitor

2019

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This paper presents a circuit for realising a fuse-programmable capacitor on-chip. The trimming mechanism is implemented using integrated circuit fuses which can be blown in order to lower the resulting equivalent capacitance. However, for integrated circuits, the non-zero fuse resistance for active fuses and finite fuse resistance for blown fuses limit the Q factor of the resulting capacitor. In this work, we present a method on how to arrange the fuses in order to achieve maximal worst-case Q factor for the given circuit topology given the process parameters and requirements on capacitance. We also analyse and discuss the accuracy and limitations of the topology with regard to fuse resistance and parasitic elements such as bond pads.

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Section: Introductionmentioning

confidence: 99%

Maximal Q Factor for an On-Chip, Fuse-Based Trimmable Capacitor

2019

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“…Assuming equal emitter currents, I E1 ¼ I E2 ¼ I E , the current through R 2 (2I E ) will also be PTAT, and therefore V PTAT will be Fig. 1 Schematic view of the cross-section of a wire-bond power semiconductor module whose devices are being monitored by singlechip temperature sensors powered by a nearby RFID reader [8] Fig. 2 Brokaw bandgap reference circuit as implemented in [11].…”

Section: Operation Of the Brokaw Bandgap Referencementioning

confidence: 99%

“…This work aims to enable the manufacturing of such a system by demonstrating a low-power integrated circuit (IC) temperature sensor that is able to operate up to at least 230 C. Low-power, high-temperature sensors can be used in conjunction with on-chip coils for power transfer to monitor the temperature of power semiconductors [8]. The concept is illustrated in Fig.…”

Section: Introductionmentioning

confidence: 99%

High-temperature characterisation and analysis of leakage-current-compensated, low-power bandgap temperature sensors

Nilsson

Borg

Johansson

2017

Analog Integr Circ Sig Process

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This paper analyses leakage current compensation techniques for low-power, bandgap temperature sensors. Experiments are conducted for circuits that compensate for collector-substrate, collector-base, bodydrain and source-body leakage currents in a Brokaw bandgap sensor. The sensors are characterised and their failure modes are analysed at temperatures from 60 to 230 C. It is found that the most appropriate compensation circuit depends on the accuracy requirements of the application and on whether a stable reference voltage is required by other parts of the circuit. Experiments show that the power consumption is dominated by leakage current at high temperatures. One type of sensor was seen to consume 260 nW at 60 C, 2:1 lW at 200 C and 14 lW at 230 C. This work is motivated by the need to accurately monitor the temperature of power semiconductors in order to predict emerging faults in power semiconductor modules, a task for which cheap, single-chip, low-power, hightemperature, wireless bandgap temperature sensors are appropriate.

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“…On-chip coils for wireless power transmission can be used to enable battery-free operation for integrated circuit systems such as implantable chips in humans [1][2][3][4] as well as for galvanically isolated, direct-contact temperature sensors for condition monitoring of power semiconductors [5,6]. For integrated circuits powered by on-chip coils, it is important to achieve a sufficiently high power transfer efficiency (PTE), so that on-chip sensors' power requirements can be met without an excessive amount of power being consumed at the transmitter.…”

Section: Introductionmentioning

confidence: 99%

“…We assess the usefulness of the results presented in this work by relating them to the application of using wireless single-chip sensors to monitor the temperature of power semiconductors in a power semiconductor module, originally proposed in [5]. A schematic view of the proposed monitoring system is shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

Load-dependent power transfer efficiency for on-chip coils

Nilsson

Borg

Johansson

2021

Analog Integr Circ Sig Process

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This paper presents a theory for the power transfer efficiency of printed circuit board coils to integrated circuit coils, with focus on load-dependence for low-power single-chip systems. The theory is verified with electromagnetic simulations modelled on a 350 nm CMOS process which in turn are verified by measurements on manufactured integrated circuits. The power transfer efficiency is evaluated by on-chip rectification of a 151 MHz signal transmitted by a spiral coil on a printed circuit board at 10 mm of separation to an on-chip coil. Such an approach avoids the influence of off-chip parasitic elements such as bond wires, which would reduce the accuracy of the evaluation. It is found that there is a lower limit for the load below which reducing the power consumption of on-chip circuits yield no increase in voltage generated at the load. For the examined process technology, this limit appears to lie around 56 k$$\Omega$$ Ω . The paper is focused on the analysis and verification of the theory behind this limit. We relate the results presented in this work to the application of wireless single-chip temperature monitoring of power semiconductors and conclude that such a system would be compatible with this limit.

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Single chip wireless condition monitoring of power semiconductor modules

Cited by 5 publications

References 8 publications

Maximal Q Factor for an On-Chip, Fuse-Based Trimmable Capacitor

Maximal Q Factor for an On-Chip, Fuse-Based Trimmable Capacitor

High-temperature characterisation and analysis of leakage-current-compensated, low-power bandgap temperature sensors

Load-dependent power transfer efficiency for on-chip coils

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